Thursday, September 03, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Toshiba's New PCs Combine Functionality, Mobility and Performance
Philips Hue Lightstrip Plus Will Paint A Whole Room
Intel Invests US$50 Million to Advance Quantum Computing
Samsung Focuses On The Internet of Things at IFA 2015
IBM and ARM Collaborate to Accelerate Delivery of Internet of Things
LG To Offer Amazon Titles In HDR On webOS Smart TV Platform
Qualcomm Details New Snapdragon 820 and Kryo CPU
IFA: Samsung Launches The "HumanFit" Wearable Platform
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > PC Parts > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, April 23, 2007
Samsung Develops New Stacking Process for DRAM


Samsung today announced that it has developed the first all-DRAM stacked memory package using 'through silicon via' (TSV) technology, which would result in memory packages that are faster, smaller and consume less power.

The new wafer-level-processed stacked package (WSP) consists of four 512 megabit (Mb) DDR2 (second generation, double data rate) DRAM (dynamic random access memory) chips that offer a combined 2 gigabits (Gb) of high density memory. Using the TSV-processed 2Gb DRAMs, Samsung can create a 4 GB (gigabyte) DIMM (dual in-line memory module) based on WSP technology for the first time. Samsung claims that its proprietary WSP technology not only reduces the overall package size, but also permits the chips to operate faster and use less power.

"The performance advancements achieved by our WSP technology can be utilized in many diverse combinations of semiconductor packaging, such as system-in-package solutions that combine logic with memory," said Tae-Gyeong Chung, vice president, Interconnect Technology Development Team, Memory Division, Samsung Electronics.

In today?s MCPs, memory chips are connected by wire bonding, requiring vertical spacing between dies that is tens of microns deep. That wire bonding process also requires horizontal spacing on the package board hundreds of microns wide for the die-connecting wires. By contrast, Samsung?s WSP technology forms laser-cut micron-sized holes that penetrate the silicon vertically to connect the memory circuits directly with a copper (Cu) filling, eliminating the need for gaps of extra space and wires protruding beyond the sides of the dies. These advantages permit Samsung?s WSP to offer a smaller footprint and thinner package.

Inside the new WSP, the TSV is housed within an aluminum (Al) pad to escape the performance-slow-down effect caused by the redistribution layer. Due to the complexity of DRAM stacking, this represented a much more difficult engineering feat than that accomplished with the first WSP, announced last year involving NAND flash dies.

There has been considerable concern that MCPs with high-speed memory chips with speed of 1.6Gb/ps next generation DRAM, would suffer from performance limitations when connected using current technologies. Samsung said that its WSP technology resolved these concerns.

In addition, as the back side of the wafer is ground away to make a thinner stack of multiple dies, the wafer has had a tendency to curve, creating physical distortion in the die. To overcome this additional critical concern in designing low-profile, high-density MCPs containing DRAM circuitry, Samsung?s wafer-thinning technology, announced last year, has been applied to improve the thin-die-cutting process.


Previous
Next
AMD Unveils New AMD Opteron Processors        All News        DaTARIUS At Mediatech Long Beach
AMD Unveils New AMD Opteron Processors     PC Parts News      Toshiba to Make 43-nm Flash Chips in '07/08

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Focuses On The Internet of Things at IFA 2015
IFA: Samsung Launches The "HumanFit" Wearable Platform
Samsung IoT Device Will Take Care Of Your Sleep
Samsung's Circular Gear S2 Smartwatches Unveiled
Samsung Used TSMC's Technology To Prevail In Chip Manufacturing Race
Samsung To Accelerate Chip Production
Samsung Announces New Wireless Audio 360 Speakers
Samsung Says Users Should Follow The Manual With Galaxy Note 5 Stylus
Samsung To Give iPhone Users The new Galaxy Smartphones
New Galaxy Note 5 Phablet Has The Best Display: report
Samsung Offers USB Flash Drive Family
Samsung Introduces Level On Wireless Pro Headphones

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .