Wednesday, October 22, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
LG Display Reports Strong Third Quarter 2014 Results
Moto 360 Android Wear Updated
Canon Announces the Second-Generation EOS C100 Mark II Digital Video Camera
G.Skill Introduces The Phoenix Blade 480GB PCIe SSD
Microsoft Is Rolling Out First New Windows 10 Preview Build
Yahoo Reports High Revenue and Profit
New Samsung Galaxy S5 'Plus' Released With Faster Processor
Google, Facebook And Comcast Spend The Most On Lobbying
Active Discussions
Copied dvd's say blank in computer only
How to generate lots of different CDs quickly
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
 Home > News > PC Parts > TSMC Ex...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, April 13, 2007
TSMC Expects to Enter 45nm Production in September


Taiwan Semiconductor Manufacturing Company has announced that it would complete 45nm technology qualification and enter production as early as September 2007.

The new 45nm process combines advanced 193nm immersion photolithography, competitive performance-enhancing silicon strains, and extreme low-k (ELK) inter-metal dielectric material.

TSMC?s 45nm low power process (LP) provides twice the density of 65nm with significantly lower power and manufacturing cost per die. With a high gate density and high-density 6T SRAM cell, more than 500 million transistors will easily fit into a 70mm2 die area. End products are expected to achieve 40 percent greater functionality or 40 percent smaller die size, with reduced power consumption. These factors are particularly crucial for system on chip (SoC) designs with an ever-smaller footprint for cell phones, portable media players, PDAs and other handheld devices.

TSMC?s 45nm general purpose and high performance process (GS) provides more than double the density and a greater than 30 percent speed enhancement over the previous generation at similar leakage power, which is especially critical to support applications in PC, networking, and wired communication.

Nvidia is likely to be the first customer of TSMC to introduce production on this half node geometry. The company has been cooperating with TSMC for a long time and it has reportedly started pilot runs on 55nm in early 2007. The graphics chip maker should introduce 55nm in volume production in the first quarter of 2008.

According to reports, AMD has also started pilot runs on 55nm.

Currently, the most advanced process used for production is the 65nm process. Intel is expected to begin producing chips at 45nm later this year.


Previous
Next
HP to Use Via Processor for PCs in China        All News        Sony BMG Drops Demos on Physical Formats
HP to Use Via Processor for PCs in China     PC Parts News      IBM Develops Chip-stacking Technique

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC Said To Make New iPad Processor
ARM and TSMC Unveil Roadmap for 64-bit ARM-based Processors on 10FinFET Process
TSMC and ARM Announce 16nm FinFET Silicon with 64-bit ARM big.LITTLE Technology
TSMC Launches Ultra-Low Power Technology Platform for IoT and Wearable Devices
TSMC Delivers First 16FinFET Networking Processor
TSMC Acquires EUV Machines For 10nm Chips
TSMC 28HPC Process Enters Volume Production
TSMC Losses Chip Orders From Apple, Qualcomm: reports
TSMC Q2 profit Increased, 20nm Chips Start Shipping
TSMC Reports Strong Q2 Sales
TSMC Aims At 10nm Chip Production By 2016
TSMC Reports Quarterly Profit

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .