Tuesday, March 03, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Samsung Lost Top Position to Apple in Q4's Global Smartphone Market
HGST To Acquire Amplidata
LG's Products Featured in Italdesign Giugiaro's Gea Concept Car
MWC: Fujitsu Delivers New Ruggedized Industrial Business Tablet
Microsoft launches Preview Program For Xbox 360
Khronos Reveals New Vulkan API for GPUs, AMD Kills Mantle
Sharp To Seek For A Second Bailout: Nikkei
Toshiba Develops STT-MRAM Circuit For High-performance Processors
Active Discussions
Need serious help!!!!
burning
nvidia 6200 review
Hello
Burning Multimedia in track 0
I'm lazy. Please help.
sanyo e6 camera
need help on some cd burning...
 Home > News > PC Parts > TSMC Ex...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, April 13, 2007
TSMC Expects to Enter 45nm Production in September


Taiwan Semiconductor Manufacturing Company has announced that it would complete 45nm technology qualification and enter production as early as September 2007.

The new 45nm process combines advanced 193nm immersion photolithography, competitive performance-enhancing silicon strains, and extreme low-k (ELK) inter-metal dielectric material.

TSMC?s 45nm low power process (LP) provides twice the density of 65nm with significantly lower power and manufacturing cost per die. With a high gate density and high-density 6T SRAM cell, more than 500 million transistors will easily fit into a 70mm2 die area. End products are expected to achieve 40 percent greater functionality or 40 percent smaller die size, with reduced power consumption. These factors are particularly crucial for system on chip (SoC) designs with an ever-smaller footprint for cell phones, portable media players, PDAs and other handheld devices.

TSMC?s 45nm general purpose and high performance process (GS) provides more than double the density and a greater than 30 percent speed enhancement over the previous generation at similar leakage power, which is especially critical to support applications in PC, networking, and wired communication.

Nvidia is likely to be the first customer of TSMC to introduce production on this half node geometry. The company has been cooperating with TSMC for a long time and it has reportedly started pilot runs on 55nm in early 2007. The graphics chip maker should introduce 55nm in volume production in the first quarter of 2008.

According to reports, AMD has also started pilot runs on 55nm.

Currently, the most advanced process used for production is the 65nm process. Intel is expected to begin producing chips at 45nm later this year.


Previous
Next
HP to Use Via Processor for PCs in China        All News        Sony BMG Drops Demos on Physical Formats
HP to Use Via Processor for PCs in China     PC Parts News      IBM Develops Chip-stacking Technique

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC Achieves EUV Productivity Milestone
TSMC Selling Sold ASML Stake
TSMC Sells LED Unit to Epistar
TSMC Chairman Sees Technical Hurdles In keeping Up With Moore's Law
TSMC To Make Intel's SoFIA Handset Chips
TSMC 16FinFET Plus Process Achieves Risk Production Milestone
TSMC Said To Make New iPad Processor
ARM and TSMC Unveil Roadmap for 64-bit ARM-based Processors on 10FinFET Process
TSMC and ARM Announce 16nm FinFET Silicon with 64-bit ARM big.LITTLE Technology
TSMC Launches Ultra-Low Power Technology Platform for IoT and Wearable Devices
TSMC Delivers First 16FinFET Networking Processor
TSMC Acquires EUV Machines For 10nm Chips

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .