Thursday, January 29, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Google Reports Increased Profit
Facebook Introduces Place Tips in News Feed
AMD Cuts Prices Of Radeon Graphics Card To Cash On GTX 970 Memory Furor
HyperX Sets DDR4 Overclocking Record
Intel 5th Generation vPro Processors Released
Mobile Provider TracFone to Pay $40 Million to Settle FTC Charges
Intel Releases New 20nm SSDs For Data Centers
Microsoft Brings Office To iOS and Android Devices
Active Discussions
Writing Audio files on DVDs ?
Need major help with Gigabeat
New match-3 puzzle game launch now!
Rimage 2000i
Sound card for my Laptop
hello
full screen wide screen
Hi
 Home > News > PC Parts > TSMC Ex...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, April 13, 2007
TSMC Expects to Enter 45nm Production in September


Taiwan Semiconductor Manufacturing Company has announced that it would complete 45nm technology qualification and enter production as early as September 2007.

The new 45nm process combines advanced 193nm immersion photolithography, competitive performance-enhancing silicon strains, and extreme low-k (ELK) inter-metal dielectric material.

TSMC?s 45nm low power process (LP) provides twice the density of 65nm with significantly lower power and manufacturing cost per die. With a high gate density and high-density 6T SRAM cell, more than 500 million transistors will easily fit into a 70mm2 die area. End products are expected to achieve 40 percent greater functionality or 40 percent smaller die size, with reduced power consumption. These factors are particularly crucial for system on chip (SoC) designs with an ever-smaller footprint for cell phones, portable media players, PDAs and other handheld devices.

TSMC?s 45nm general purpose and high performance process (GS) provides more than double the density and a greater than 30 percent speed enhancement over the previous generation at similar leakage power, which is especially critical to support applications in PC, networking, and wired communication.

Nvidia is likely to be the first customer of TSMC to introduce production on this half node geometry. The company has been cooperating with TSMC for a long time and it has reportedly started pilot runs on 55nm in early 2007. The graphics chip maker should introduce 55nm in volume production in the first quarter of 2008.

According to reports, AMD has also started pilot runs on 55nm.

Currently, the most advanced process used for production is the 65nm process. Intel is expected to begin producing chips at 45nm later this year.


Previous
Next
HP to Use Via Processor for PCs in China        All News        Sony BMG Drops Demos on Physical Formats
HP to Use Via Processor for PCs in China     PC Parts News      IBM Develops Chip-stacking Technique

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC Selling Sold ASML Stake
TSMC Sells LED Unit to Epistar
TSMC Chairman Sees Technical Hurdles In keeping Up With Moore's Law
TSMC To Make Intel's SoFIA Handset Chips
TSMC 16FinFET Plus Process Achieves Risk Production Milestone
TSMC Said To Make New iPad Processor
ARM and TSMC Unveil Roadmap for 64-bit ARM-based Processors on 10FinFET Process
TSMC and ARM Announce 16nm FinFET Silicon with 64-bit ARM big.LITTLE Technology
TSMC Launches Ultra-Low Power Technology Platform for IoT and Wearable Devices
TSMC Delivers First 16FinFET Networking Processor
TSMC Acquires EUV Machines For 10nm Chips
TSMC 28HPC Process Enters Volume Production

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .