Thursday, November 26, 2015
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Panasonic's CX Ultra HD Smart TVs Bring 4K Closer To Home
New LG Ray Smartphone Focuses On Photo Shooting
HP Profit Lower Than Expected
Police Arrests Fifth Suspect In TalkTalk Hack Investigation
Toshiba Develops Fast 3D Metal Printer
ECS LIVA X2 Mini PC Runs Windows 10
Memory-Tech Ready To Start Mass Production Of UHD Blu-ray Disc
New Nokia 230 and Nokia 230 Dual SIM Phones Coming Next Month
Active Discussions
roxio issues with xp pro
How to back up a PS2 DL game
Copy a protected DVD?
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > PC Parts > TSMC Ex...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, April 13, 2007
TSMC Expects to Enter 45nm Production in September

Taiwan Semiconductor Manufacturing Company has announced that it would complete 45nm technology qualification and enter production as early as September 2007.

The new 45nm process combines advanced 193nm immersion photolithography, competitive performance-enhancing silicon strains, and extreme low-k (ELK) inter-metal dielectric material.

TSMC?s 45nm low power process (LP) provides twice the density of 65nm with significantly lower power and manufacturing cost per die. With a high gate density and high-density 6T SRAM cell, more than 500 million transistors will easily fit into a 70mm2 die area. End products are expected to achieve 40 percent greater functionality or 40 percent smaller die size, with reduced power consumption. These factors are particularly crucial for system on chip (SoC) designs with an ever-smaller footprint for cell phones, portable media players, PDAs and other handheld devices.

TSMC?s 45nm general purpose and high performance process (GS) provides more than double the density and a greater than 30 percent speed enhancement over the previous generation at similar leakage power, which is especially critical to support applications in PC, networking, and wired communication.

Nvidia is likely to be the first customer of TSMC to introduce production on this half node geometry. The company has been cooperating with TSMC for a long time and it has reportedly started pilot runs on 55nm in early 2007. The graphics chip maker should introduce 55nm in volume production in the first quarter of 2008.

According to reports, AMD has also started pilot runs on 55nm.

Currently, the most advanced process used for production is the 65nm process. Intel is expected to begin producing chips at 45nm later this year.

HP to Use Via Processor for PCs in China        All News        Sony BMG Drops Demos on Physical Formats
HP to Use Via Processor for PCs in China     PC Parts News      IBM Develops Chip-stacking Technique

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC Could Sell Stake To Chinese: CEO
TSMC Releases Low-cost Version of 16nm FinFET
TSMC Said To Have Secured A10 Chip Orders From Apple
Samsung Used TSMC's Technology To Prevail In Chip Manufacturing Race
TSMC to Cease Solar Manufacturing Operations
TSMC Starts Mass Production Of 16nm Chips
TSMC To Move To 10nm Production in 2016
TSMC Solar Commercial-size Modules Achieve Record Efficiency
TSMC Start 10nm Manufacturing in mid-2016
TSMC Reports 65 pct Rise in Q1 Profit
TSMC Achieves EUV Productivity Milestone
TSMC Selling Sold ASML Stake

Most Popular News
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .