Friday, July 29, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Worldwide Smartphone Volumes Relatively Flat in Q2 2016
Oracle to Buy NetSuite for $9.3 Billion
Samsung and Nestle Collaborate on the Internet of Things and Nutrition
Home Appliance and Home Entertainment Units Help LG's Quarterly Profits
Facebook Reports Sharp Ad Sales Growth
Samsung Second Quarter Results Boosted By Component Sales
Microsoft Adds Artificial Intelligence Elements To New Smart Camera App
Xiaomi Announces Redmi Pro OLED Smartphone And Mi Notebook Air Laptop
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > TSMC Ex...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, April 13, 2007
TSMC Expects to Enter 45nm Production in September


Taiwan Semiconductor Manufacturing Company has announced that it would complete 45nm technology qualification and enter production as early as September 2007.

The new 45nm process combines advanced 193nm immersion photolithography, competitive performance-enhancing silicon strains, and extreme low-k (ELK) inter-metal dielectric material.

TSMC?s 45nm low power process (LP) provides twice the density of 65nm with significantly lower power and manufacturing cost per die. With a high gate density and high-density 6T SRAM cell, more than 500 million transistors will easily fit into a 70mm2 die area. End products are expected to achieve 40 percent greater functionality or 40 percent smaller die size, with reduced power consumption. These factors are particularly crucial for system on chip (SoC) designs with an ever-smaller footprint for cell phones, portable media players, PDAs and other handheld devices.

TSMC?s 45nm general purpose and high performance process (GS) provides more than double the density and a greater than 30 percent speed enhancement over the previous generation at similar leakage power, which is especially critical to support applications in PC, networking, and wired communication.

Nvidia is likely to be the first customer of TSMC to introduce production on this half node geometry. The company has been cooperating with TSMC for a long time and it has reportedly started pilot runs on 55nm in early 2007. The graphics chip maker should introduce 55nm in volume production in the first quarter of 2008.

According to reports, AMD has also started pilot runs on 55nm.

Currently, the most advanced process used for production is the 65nm process. Intel is expected to begin producing chips at 45nm later this year.


Previous
Next
HP to Use Via Processor for PCs in China        All News        Sony BMG Drops Demos on Physical Formats
HP to Use Via Processor for PCs in China     PC Parts News      IBM Develops Chip-stacking Technique

Get RSS feed Easy Print E-Mail this Message

Related News
TSMC To Follow The Extreme Ultraviolet Approach For 5nm
TSMC 2Q16 Profits Fall, Revenue Grew
TSMC to Boost R&D Spending To Accelerate Development Of More Advanced Chips
ARM And TSMC Validate First Multicore Test Chip Based on 10FinFET Technology
TSMC On Track To Move InFO Packaging Technology to Volume Production
TSMC Forecasts Slow Sales Amid Smartphone Slowdown
TSMC To Build 12-inch Fab In China
ARM and TSMC To Collaborate on 7nm FinFET Process Technology
Samsung Lost iPhone 7 Chip Contract
TSMC Says Recent Earthquake Damaged Wafers
TSMC Wins Exclusive Chip Contract For Next iPhone: report
Chip Makers Differientate In terms Of Equipment Investments

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .