Tuesday, April 21, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Samsung To Make New Qualcomm Processors: report
ARM Reports Strong Chip Sales For The First Quarter 2015
Nichia Develops New Energy-efficient Laser For TVs
Samsung Leads The Global SSD Market
Buffalo's New Ruggedized Portable Hard DriveHas NFC Capabilities
Google To Serve Ads Through HTTPS
IBM Revenue Falls In Q1
Twitter Allows Everyone To Send You A Direct Message
Active Discussions
Optiarc AD-7260S review
Help make DVDInfoPro better with dvdinfomantis!!!
Question about nero
Copied dvd's say blank in computer only
menu making
cdrw trouble
Need serious help!!!!
burning
 Home > News > PC Parts > IBM Dev...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, April 12, 2007
IBM Develops Chip-stacking Technique


IBM said on Wednesday it will be able to make microchips faster and more energy efficient by stacking components on top of each other, a breakthrough that cuts the distance an electrical signal needs to travel.

The technique works by drilling tiny holes through a wafer of silicon and filling them with metal. Components such as memory can then be stacked on top of the main part of the chip, eliminating the need for wires stretching out to the sides.

IBM likened the method to replacing a sprawling airport parking lot with a multi-storied garage right next to the terminal. Like people walking from the garage to the terminal, electrical signals do not have to travel as far in a chip with stacked components.

"It opens up a range of applications and neat things we can do," said Lisa Su, head of semiconductor research at IBM.

IBM will use the method to make power management chips for wireless devices later this year, allowing them to use 40 percent less power than previous versions, according to IBM.

Eventually, IBM plans to incorporate the technique into full-blown processors.

IBM said that the new technique will extend Moore?s Law beyond its expected limits.

It is the latest achievement by IBM's semiconductor researchers, who have in recent months hit upon several breakthroughs in materials science and chip design. In December, IBM announced the first 45nm chips using immersion lithography and ultra-low-K interconnect dielectrics.

In January, IBM announced "high-k metal gate," which substitutes a new material into a critical portion of the transistor that controls its primary on/off switching function. The material provides superior electrical properties, while allowing the size of the transistor to be shrunk beyond limits being reached today.

In February,IBM revealed a first-of-its-kind, on-chip memory technology that features the fastest access times ever recorded in eDRAM (embedded dynamic random access memory).

Then in March, IBM unveiled a prototype optical transceiver chipset capable of reaching speeds at least eight-times faster than optical components available today.


Previous
Next
AACS Revokes Blu-ray, HD DVD Hacked Keys        All News        Toshiba, Matsushita Aims to Sell TV-use OLED Panels
TSMC Expects to Enter 45nm Production in September     PC Parts News      Crucial Announces 1066MHz Ballistix & Ballistix Tracer Memory

Get RSS feed Easy Print E-Mail this Message

Related News
IBM Revenue Falls In Q1
IBM Opens Threat Intelligence to Combat Cyber Attacks
IBM Announces Partnerships to Transform Personal Health with Watson and Open Cloud
IBM Sets New Record for Tape Storage
IBM and China Telecom Partner to Accelerate Mobile Enterprise Adoption in China
IBM Connects Internet of Things to the Enterprise
IBM Delivers Cloud Data Services with Twitter Built-In
IBM Buys AlchemyAPI
IBM Unveils New Storage Solutions Based on Micron's Flash
IBM BigInsights Introduces Machine Learning With R
IBM Says Popular Dating Apps Are Vulnerable to Hackers
Cloud Cryptographic Algorithm Protects Personal Data

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .