Sunday, January 25, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Sony Postpones Earnings Announcement
January Windows 10 Build Released Through The Windows Insider Program
Flexible Computers Are Stil Away From Reality
China Denies Microsoft Outlook Hacking Allegations
A Look at Microsoft's New Spartan Browser
JOLED Joint Venture Company Established
Samsung Engineers Develop Wearable Sensor for Stroke Detection
Skype To Be Part Of Windows 10
Active Discussions
HELP!!!
full screen wide screen
UDF errors
Hi
The Simplest Way to Download KODAK HERO 7.1 Driver
About the restriction problem of chapter quantity in DVD
Booktype utilities for LiteON and OEM DVD Recorders
downgrade a nero vision 5 project to nero vision 2
 Home > News > PC Parts > IBM Dev...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, April 12, 2007
IBM Develops Chip-stacking Technique


IBM said on Wednesday it will be able to make microchips faster and more energy efficient by stacking components on top of each other, a breakthrough that cuts the distance an electrical signal needs to travel.

The technique works by drilling tiny holes through a wafer of silicon and filling them with metal. Components such as memory can then be stacked on top of the main part of the chip, eliminating the need for wires stretching out to the sides.

IBM likened the method to replacing a sprawling airport parking lot with a multi-storied garage right next to the terminal. Like people walking from the garage to the terminal, electrical signals do not have to travel as far in a chip with stacked components.

"It opens up a range of applications and neat things we can do," said Lisa Su, head of semiconductor research at IBM.

IBM will use the method to make power management chips for wireless devices later this year, allowing them to use 40 percent less power than previous versions, according to IBM.

Eventually, IBM plans to incorporate the technique into full-blown processors.

IBM said that the new technique will extend Moore?s Law beyond its expected limits.

It is the latest achievement by IBM's semiconductor researchers, who have in recent months hit upon several breakthroughs in materials science and chip design. In December, IBM announced the first 45nm chips using immersion lithography and ultra-low-K interconnect dielectrics.

In January, IBM announced "high-k metal gate," which substitutes a new material into a critical portion of the transistor that controls its primary on/off switching function. The material provides superior electrical properties, while allowing the size of the transistor to be shrunk beyond limits being reached today.

In February,IBM revealed a first-of-its-kind, on-chip memory technology that features the fastest access times ever recorded in eDRAM (embedded dynamic random access memory).

Then in March, IBM unveiled a prototype optical transceiver chipset capable of reaching speeds at least eight-times faster than optical components available today.


Previous
Next
AACS Revokes Blu-ray, HD DVD Hacked Keys        All News        Toshiba, Matsushita Aims to Sell TV-use OLED Panels
TSMC Expects to Enter 45nm Production in September     PC Parts News      Crucial Announces 1066MHz Ballistix & Ballistix Tracer Memory

Get RSS feed Easy Print E-Mail this Message

Related News
IBM Posts Fourth-quarter Results
IBM Launches Powerful z13 Mainframe
IBM Retains U.S. Patent Record in 2014
Intel, IBM Follow Different Strategies On 14nm FinFET
Apple and IBM Bring Big Data Analytics and Security Capabilities on iPhone And iPad
Mobile Shopping Dominated During Thanksgiving And Black Friday
IBM Patents Cloud Privacy Engine
IBM Introduces Verse Business E-mail With Social Media Integration
Lufthansa Signs $1.25 billion Deal with IBM
Twitter and IBM Form Partner to Data Analytics
Glonbalfoundries Buy IBM's Micorelectronics Business
New IBM Tape Cartridge Holds 10TB Uncompressed Data

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .