Thursday, July 31, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Samsung Q3 Sales and Profits Down despite Galaxy S5 launch
Apple May lay Off People at Beats: report
Japanese Giants Form JOLED Company To Compete With LG, Samsung
BitTorrent U Secure Online Calling Software Bleep
Fujitsu Semiconductor and ON Semiconductor Announce Foundry Agreement
Kaleidescape Joins the One-Blue Licensing Program
AMD Opteron 64-Bit ARM-Based Developer Kits Now Available
Samsung Galaxy Note 4 Coming On September 3
Active Discussions
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
Video editing software.
 Home > News > PC Parts > IBM Dev...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, April 12, 2007
IBM Develops Chip-stacking Technique


IBM said on Wednesday it will be able to make microchips faster and more energy efficient by stacking components on top of each other, a breakthrough that cuts the distance an electrical signal needs to travel.

The technique works by drilling tiny holes through a wafer of silicon and filling them with metal. Components such as memory can then be stacked on top of the main part of the chip, eliminating the need for wires stretching out to the sides.

IBM likened the method to replacing a sprawling airport parking lot with a multi-storied garage right next to the terminal. Like people walking from the garage to the terminal, electrical signals do not have to travel as far in a chip with stacked components.

"It opens up a range of applications and neat things we can do," said Lisa Su, head of semiconductor research at IBM.

IBM will use the method to make power management chips for wireless devices later this year, allowing them to use 40 percent less power than previous versions, according to IBM.

Eventually, IBM plans to incorporate the technique into full-blown processors.

IBM said that the new technique will extend Moore?s Law beyond its expected limits.

It is the latest achievement by IBM's semiconductor researchers, who have in recent months hit upon several breakthroughs in materials science and chip design. In December, IBM announced the first 45nm chips using immersion lithography and ultra-low-K interconnect dielectrics.

In January, IBM announced "high-k metal gate," which substitutes a new material into a critical portion of the transistor that controls its primary on/off switching function. The material provides superior electrical properties, while allowing the size of the transistor to be shrunk beyond limits being reached today.

In February,IBM revealed a first-of-its-kind, on-chip memory technology that features the fastest access times ever recorded in eDRAM (embedded dynamic random access memory).

Then in March, IBM unveiled a prototype optical transceiver chipset capable of reaching speeds at least eight-times faster than optical components available today.


Previous
Next
AACS Revokes Blu-ray, HD DVD Hacked Keys        All News        Toshiba, Matsushita Aims to Sell TV-use OLED Panels
TSMC Expects to Enter 45nm Production in September     PC Parts News      Crucial Announces 1066MHz Ballistix & Ballistix Tracer Memory

Get RSS feed Easy Print E-Mail this Message

Related News
IBM Talks With Globalfoundries Stall Over Price: report
Apple and IBM Partner On Enterprise Mobility
IBM Announces $3 Billion Investment In Future Chip Research
IBM To Help China Deliver on Ambitious Energy and Environmental Goals
China Clears IBM, Lenovo Server Deal
IBM Hopes Nanotube Transistors Are Coming Aroud 2020
IBM May Sell Chip-Making Unit to Globalfoundries: report
IBM Ships POWER8 Power System Servers
IBM Patent Helps Eliminate Fraudulent Behavior in the Cloud
IBM And Fujifilm Squeeze Really Big Data In Magnetic Tapes
Researchers Discover New 'Self-healing' Industrial Polymers
IBM Develops Ultra-fast Phase Change Memory System

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .