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Thursday, February 08, 2007
OCZ Unveils the New PC2-6400 Flex XLC CAS 3 Series


This latest edition to the highly-awarded OCZ Flex XLC product family is engineered to produce significant performance gains on the latest NVIDIA nForce SLI platforms by implementing Enhanced Performance Profiles (EPP) and allowing the memory to operate at a stable 800MHz at CL3 upon start up.

Developed and tested on the 680i platform, the Flex XLC CL3 series provides rock-solid stability and compatibility for enthusiasts looking to reap the benefits of aggressively priced, low latency memory.

Demonstrating great potential for tweaking and overclocking memory, the NVIDIA 680i chipset allows enthusiasts to squeeze the most performance out of their memory. With that in mind, the latest PC2-6400 Flex modules were integrated with an EPP programmed SPD to immediately boot at the correct settings to produce 3-4-4 timings on 680i motherboards. This feature provides a true "Plug and Play" overclocking feature that eliminates the need for manual configuration and makes memory optimizations a household item for the complete range of consumers looking to maximize system performance through overclocking.

The new DDR2-800 CL3 modules feature OCZ's original Flex XLC (Xtreme Liquid Convention) heatsink which delivers superior heat dissipation via a hybrid copper and aluminum design alterable between passive air or water cooling. The Flex XLC module was engineered with this unique "flexible" design to give enthusiasts the option to run the modules passively or water cooled via the integrated liquid injection system. The concurrent use of both technologies (water-cooling) promotes maximum heat dissipation. Thanks to OCZ's Flex XLC heat management solution, the OCZ PC2-6400 CL3 operates with an optimal balance of high speeds and low latency without the high temperatures that inhibit or damage the module's ICs.

The PC2-6400 Flex XLC CAS 3 modules will be available in 2GB (2x1024MB) dual channel kits.


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