Wednesday, October 26, 2016
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Microsoft Brings 3D Creativity To Winsdows 10, Launches Surface Studio, Surface Book i7 And Affordable VR Headset
Alphabet Cutting Jobs in Google Fiber, Pauses Expansion Plans
Nintendo Cuts Profit Forecast
Sony To Establish New Imaging Products And Solutions Company
Samsung Pay Expand In New Russia, Thailand and Malaysia
Samsung Introduces New ARTIK Smart IoT Platform Modules
iPhone Sales Declined, But Services Revenue Grew In Last Fiscal Quarter
Google's Jamboard Reinverts The Whiteboard For Collaboration in the Cloud
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Consumer Electronics > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, February 02, 2007
Samsung Improves Heat Dissipation in LCD TVs

Samsung claims that it has developed the industry's first thermally-enhanced chip-on-film (TECOF) package for the display driver IC (DDI) used in large-screen, high-resolution LCD TVs.

The new DDI package improves thermal heat dissipation by 20 percent over a conventional COF package, allowing the DDI to last longer and operate with greater reliability.

A typical DDI requires at least 15 volts of power to drive these larger, higher-resolution LCD TV panels that operate on broader frequency spectrums to reproduce high-speed video images. As a result, the DDI generates greater heat, which can create reliability problems.

Samsung has developed a new material for the thin metal tape component that has the optimal properties for effectively maximizing heat dissipation. The company has also developed a new automated process for attaching the metal tape to the COF package. By applying Samsung's new TECOF package, the thermal emissions from the DDI are quickly released via the metal tape, minimizing heat buildup.

In addition, heat build-up limits the number of channels a single DDI chip can cover, reducing the total number of DDI per panel. With the new TECOF package, the number of source DDIs for a full-HD LCD TV is reduced from fourteen 414 channel-DDIs to eight 720 channel-DDIs.

Samsung has completed reliability testing of the new TECOF package and expects to ship its DDI product with the new TECOF package technology in the 2 nd quarter of 2007.

NEC Introduces Bright Projector Under Four Pounds        All News        Panasonic Hollywood Blu-ray Testing Center Established
NEC Introduces Bright Projector Under Four Pounds     Consumer Electronics News      iPod Shuffle Now Available in Five Brilliant Colors

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Pay Expand In New Russia, Thailand and Malaysia
Samsung Introduces New ARTIK Smart IoT Platform Modules
Samsung Set To Announce 2nd Generation ARTIK Processor For IoT Devices
Samsung Galaxy Tab A 10.1" With S Pen Released
Samsung Galaxy Note 7 Customers To Get New Galaxy Note 8 Or Galaxy S8 Smartphones Half Price
Samsung to Exchange Galaxy Note 7 with New Galaxy S8
Samsung Could Use LG Chem batteries For Future Smartphones
Samsung Rolls Out First 10nm 8GB LPDDR4 DRAM Package
Samsung S3 Smartwatch Is Coming Next Month
Quick Benchmarks With The Samsung NVMe M.2 960 PRO SSD
Samsung' Next QLED TVs Will Be Launched Under The SUHD QLED TV Name
Samsung Starts Making 10nm SoCs, Gears Up For Galaxy S8

Most Popular News
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .