Friday, September 04, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
LG Bets On OLED's Success, Showcases Innovative Prototypes At IFA2015
Acer's Predator 6 Smartphone Packs A 10-core Processor
New Intuos Tablets Bring Your Creative Dreams Closer
Fujitsu Doubles Same-Cell Wireless Communication Capacity for 5G
Justice Department Hardens Cellphone Tracking Rules
ALCATEL ONETOUCH Unveiled Its Latest Smartphones And A Smartwatch at IFA
Firefox for iOS Now Available for Preview
ZTE Axon Elite Smartphone Coming To The Global Market
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > Consumer Electronics > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, February 02, 2007
Samsung Improves Heat Dissipation in LCD TVs


Samsung claims that it has developed the industry's first thermally-enhanced chip-on-film (TECOF) package for the display driver IC (DDI) used in large-screen, high-resolution LCD TVs.

The new DDI package improves thermal heat dissipation by 20 percent over a conventional COF package, allowing the DDI to last longer and operate with greater reliability.

A typical DDI requires at least 15 volts of power to drive these larger, higher-resolution LCD TV panels that operate on broader frequency spectrums to reproduce high-speed video images. As a result, the DDI generates greater heat, which can create reliability problems.



Samsung has developed a new material for the thin metal tape component that has the optimal properties for effectively maximizing heat dissipation. The company has also developed a new automated process for attaching the metal tape to the COF package. By applying Samsung's new TECOF package, the thermal emissions from the DDI are quickly released via the metal tape, minimizing heat buildup.

In addition, heat build-up limits the number of channels a single DDI chip can cover, reducing the total number of DDI per panel. With the new TECOF package, the number of source DDIs for a full-HD LCD TV is reduced from fourteen 414 channel-DDIs to eight 720 channel-DDIs.

Samsung has completed reliability testing of the new TECOF package and expects to ship its DDI product with the new TECOF package technology in the 2 nd quarter of 2007.


Previous
Next
NEC Introduces Bright Projector Under Four Pounds        All News        Panasonic Hollywood Blu-ray Testing Center Established
NEC Introduces Bright Projector Under Four Pounds     Consumer Electronics News      iPod Shuffle Now Available in Five Brilliant Colors

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Seeks Piece of Nascent Smartwatch Market With New Gear S2 Smartwatch
Samsung Focuses On The Internet of Things at IFA 2015
IFA: Samsung Launches The "HumanFit" Wearable Platform
Samsung IoT Device Will Take Care Of Your Sleep
Samsung's Circular Gear S2 Smartwatches Unveiled
Samsung Used TSMC's Technology To Prevail In Chip Manufacturing Race
Samsung To Accelerate Chip Production
Samsung Announces New Wireless Audio 360 Speakers
Samsung Says Users Should Follow The Manual With Galaxy Note 5 Stylus
Samsung To Give iPhone Users The new Galaxy Smartphones
New Galaxy Note 5 Phablet Has The Best Display: report
Samsung Offers USB Flash Drive Family

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .