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Thursday, January 18, 2007
OCZ Launched New DDR2-1150 FlexXLC Memory


The new PC2-6400 Flex XLC delivers unprecedented speed, signal integrity, and thermal management, all at a lower price point than the current flagship high-speed binned Flex XLC solution.

These new DDR2-800 modules feature OCZ's original Flex XLC (Xtreme Liquid Convention) heatsink which delivers superior heat dissipation via a hybrid copper and aluminum design alterable between passive air or water cooling. The Flex XLC module was engineered with this unique "flexible" design to give enthusiasts the option to run the modules passively or water cooled via the integrated liquid injection system. The concurrent use of both technologies (water-cooling) promotes maximum heat dissipation. Thanks to OCZ's Flex XLC heat management solution, the OCZ PC2-6400 operates at extreme speeds without the high temperatures that inhibit or damage the module's ICs.



"The overwhelming demand for our first Flex XLC modules shows us that this design is exactly what ultimate enthusiasts are looking for," commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. "To ensure that none of our customers feel left out, we are releasing a more affordable, lower voltage 800 MHz version of our flagship memory product with built-in headroom for those who really want to explore the benefits of overclocking."

The PC2-6400 Flex XLC CAS 4 modules are optimized for the latest cutting edge platforms and will be available in 2GB (2x1024MB) dual channel kits. As part of OCZ's line-up of premium memory, the PC2-6400 series is backed by a Lifetime Warranty and industry-leading technical support.


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