Thursday, September 18, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Oracle's Ellison Steps Down
Qualcomm Announces Vuforia for Digital Eyewear, LTE Broadcast SDK, Demos Upcoming 810 SoC
Dropbox, Google, Open Technology Fund, Security Researchers Announce Simply Secure
Apple And U2 To Develop New Digital Music Format
AT&T Launches High-speed U-verse Service for Businesses
AMD Moves Closer To The Introduction Of Project FreeSync Monitors
Ericsson to Shut Modem Business
VIA Launches ARTiGO A900 Android System For IoT and M2M Deployments
Active Discussions
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
 Home > News > PC Parts > AMD and...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, December 13, 2006
AMD and IBM Detail Early Results Using Immersion and Ultra Low-K in 45NM Chips


IBM and AMD presented papers describing the use of immersion lithography, ultra-low-K interconnect dielectrics, and multiple enhanced transistor strain techniques for application to the 45nm microprocessor process generation.

The presentations took place at the International Electron Device Meeting (IEDM) yesterday. AMD and IBM expect the first 45nm products using immersion lithography and ultra-low-K interconnect dielectrics to be available in mid-2008.

"As the first microprocessor manufacturers to announce the use of immersion lithography and ultra-low-K interconnect dielectrics for the 45nm technology generation, AMD and IBM continue to blaze a trail of innovation in microprocessor process technology,? "Immersion lithography will allow us to deliver enhanced microprocessor design definition and manufacturing consistency, further increasing our ability to deliver industry-leading, highly sophisticated products to our customers. Ultra-low-K interconnect dielectrics will further extend our industry-leading microprocessor performance-per-watt ratio for the benefit of all of our customers," said Nick Kepler, vice president of logic technology development at AMD.

Current process technology uses conventional lithography, which has limitations in defining microprocessor designs beyond the 65nm process technology generation. Immersion lithography uses a transparent liquid to fill the space between the projection lens of the step-and-repeat lithography system and the wafer that contains hundreds of microprocessors. This significant advance in lithography provides increased depth of focus and improved image fidelity that can improve chip-level performance and manufacturing efficiency. For example, the performance of an SRAM cell shows improvements of approximately 15 per cent due to this enhanced process capability, without resorting to more costly double-exposure techniques, according to the companies.

In addition, the use of porous, ultra-low-K dielectrics to reduce interconnect capacitance and wiring delay is a critical step in further improving microprocessor performance as well as lowering power dissipation. This advance is enabled through the development of an ultra-low-K process integration that reduces the dielectric constant of the interconnect dielectric while maintaining the mechanical strength. The addition of ultra-low-K interconnect provides a 15 per cent reduction in wiring-related delay as compared to conventional low-K dielectrics.

IBM and AMD have been collaborating on the development of next-generation semiconductor manufacturing technologies since January 2003. In November 2005, the two companies announced an extension of their joint development efforts until 2011 covering 32nm and 22nm process technology generations.


Previous
Next
BenQ to Debut Full Line of 2007 Widescreen LCD Monitors for Gamers        All News        Ubisoft and CBS Announced CSI: Hard Evidence
BenQ to Debut Full Line of 2007 Widescreen LCD Monitors for Gamers     PC Parts News      Corsair Released 16GB Flash Voyager USB Drives

Get RSS feed Easy Print E-Mail this Message

Related News
AMD Moves Closer To The Introduction Of Project FreeSync Monitors
IBM Offers Watson Data Tool To the Mainstream
AMD Introduces DirectGMA on AMDs FirePro GPUs
IBM and Intel Bring New Security Features to the Cloud
AMD Launches AMD Radeon R9 285 Graphics, "Never Settle: Space Edition" Game Bundle
AMD Introduces New 8-core FX-series Processors
AMD Announces Heterogeneous C++ AMP Language for Developers
New AMD R9 285 Radeon Graphics Card Unveiled
IBM Tries To Strengthen Its Presence In China With Local Vendor Deal
AMD Officially Releases The OCZ-rebranded, Radeon R7 SSDs
U.S. Regulators Clear Sale Of IBM's Server Business to Lenovo
AMD, Nvidia, Refresh Their Professional Graphics Cards Lineups

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .