Wednesday, September 17, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
New iPads And OS X Yosemite Announcements Expected Next Month
Opera Max Data-savings App to be Embedded into MediaTek?s LTE SoCs
Nero 2015 Supports Burning via Smartphone, WiFi Streaming
PMC Delivers 16-port SAS and SATA Storage Controllers
Google, Facebook and Twitter Collaborate On TODO Project
NBA 2K15 Allows You To Put Your Face Into The Game
Latest Cyberlink PowerDirector Offers Cloud Storage Features
Apple iOS 8 Coming On Wednesday
Active Discussions
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
 Home > News > PC Parts > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, November 01, 2006
Samsung Develops 16-Chip Multi-Stack Package Technology


Samsung announced today that it has developed the industry?s first process to enable production of a 16-chip multi-chip package (MCP) of memory.

Samsung?s new 16-chip MCP technology, when applied to 8Gb NAND flash chips, can enable up to a 16 gigabyte (GB) MCP solution.

Advanced multi-chip package technology requires a combination of key processes such as wafer thinning technology, redistribution layer technology, chip sawing technology and wire bonding technology.

To increase the number of chips stacked vertically, the need for further wafer thinning was a critical design obstacle. For the new 16-chip process, Samsung introduced wafer-thinning technology that eliminates 24 over 25 (24/25) of the thickness of each fabricated wafer to reduce the overall thickness to only 30-microns (um). This is just 65 percent the thickness of the 10-chip MCP wafer (45 um) Samsung developed in 2005 and similar to the size of a human cell, which measures 20 to 30 microns.



As part of its MCP technology, Samsung also developed a new laser-cutting technology to cut the wafer into individual chips. This new cutting process prevents the memory chips from breaking into pieces when they are cut using conventional blade sawing technology, which was originally designed only for sawing wafers up to 80 microns thick.

To vertically stack identically-sized dies (chips), a redistribution layer technology also is applied in Samsung?s new multi-stack MCP process, to enable wafer fabricators to adhere the wire contacts from just one side, unlike the conventional method of extending wire connection from both sides of each chip. Along with a single wire contact per die, the dies are placed in a zigzag stack to minimize the use of space and the length of the wire connectors. Moreover, the thickness of the adhesive has been reduced to 20 microns bringing the height of a 16-die stack to 1.4mm. (A 10-chip MCP uses a 60-micron adhesive layer and has a total height of 1.6mm.)

Samsung?s new 16-chip MCP was developed just one year after the development of the first 10-chip MCP. The new 16-chip MCP package technology provides the highest density solution yet developed for the creation of slimmer consumer electronics.


Previous
Next
Midway Ships Unreal Anthology for PC        All News        Nvidia GeForce 8800 Specs Leaked
Hitachi Unveils 2.5-inch Hard Drive Roadmap     PC Parts News      OCZ Expands SD Dual Product Line to Now Offer 133X Speeds

Get RSS feed Easy Print E-Mail this Message

Related News
New Samsung NX1 Launches With APS-C backside-illuminated CMOS
Korean Authorities To Inverstigate LG-Samsung Dispute
Samsung Open Source Conference Kicks off Tuesday
Diesel Black Gold Introduces Custom Samsung Gear S at Runway Show
Samsung Outlines Its Vision for the Future Home At IFA 2014
Samsung Launches Tizen Wearable SDK for Gear S
Samsung Galaxy Tab Active Announced At IFA
Samsung Goes Curvy At IFA 2014
Samsung Partners With Oculus On Gear VR, Announces Galaxy Note 4 And Galaxy Edge at IFA 2014
Samsung Acquires Canadian Cloud Solution Provider
Samsung Introduces First Curved Soundbar For TVs
Samsung Partners with Nike On Running App

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .