Sunday, April 19, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Samsung Logo Removed From Japanese Smartphones
Google Is Getting Serious With Project Loon
New Technology Can Track Detailed Hand Motion
Office Universal apps Coming Next Month On Windows 10 for Phones
FCC Makes 150 MHz Of Contiguous Spectrum Available To Telecom Companies
Google Extends Chrome Support For Windows XP
ASUS X99 and Z97 Motherboards Now Support NVM Express Devices
AMD Reports Loss, Exits From High-density Server Business
Active Discussions
Help make DVDInfoPro better with dvdinfomantis!!!
Question about nero
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
cdrw trouble
Need serious help!!!!
burning
 Home > News > PC Parts > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, November 01, 2006
Samsung Develops 16-Chip Multi-Stack Package Technology


Samsung announced today that it has developed the industry?s first process to enable production of a 16-chip multi-chip package (MCP) of memory.

Samsung?s new 16-chip MCP technology, when applied to 8Gb NAND flash chips, can enable up to a 16 gigabyte (GB) MCP solution.

Advanced multi-chip package technology requires a combination of key processes such as wafer thinning technology, redistribution layer technology, chip sawing technology and wire bonding technology.

To increase the number of chips stacked vertically, the need for further wafer thinning was a critical design obstacle. For the new 16-chip process, Samsung introduced wafer-thinning technology that eliminates 24 over 25 (24/25) of the thickness of each fabricated wafer to reduce the overall thickness to only 30-microns (um). This is just 65 percent the thickness of the 10-chip MCP wafer (45 um) Samsung developed in 2005 and similar to the size of a human cell, which measures 20 to 30 microns.



As part of its MCP technology, Samsung also developed a new laser-cutting technology to cut the wafer into individual chips. This new cutting process prevents the memory chips from breaking into pieces when they are cut using conventional blade sawing technology, which was originally designed only for sawing wafers up to 80 microns thick.

To vertically stack identically-sized dies (chips), a redistribution layer technology also is applied in Samsung?s new multi-stack MCP process, to enable wafer fabricators to adhere the wire contacts from just one side, unlike the conventional method of extending wire connection from both sides of each chip. Along with a single wire contact per die, the dies are placed in a zigzag stack to minimize the use of space and the length of the wire connectors. Moreover, the thickness of the adhesive has been reduced to 20 microns bringing the height of a 16-die stack to 1.4mm. (A 10-chip MCP uses a 60-micron adhesive layer and has a total height of 1.6mm.)

Samsung?s new 16-chip MCP was developed just one year after the development of the first 10-chip MCP. The new 16-chip MCP package technology provides the highest density solution yet developed for the creation of slimmer consumer electronics.


Previous
Next
Midway Ships Unreal Anthology for PC        All News        Nvidia GeForce 8800 Specs Leaked
Hitachi Unveils 2.5-inch Hard Drive Roadmap     PC Parts News      OCZ Expands SD Dual Product Line to Now Offer 133X Speeds

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Logo Removed From Japanese Smartphones
The Latest On Nvidia's Patent Dispute with Samsung
Samsung Display Buys Quantum Dot Technology From SEC
Samsung Galaxy S6 Edge Pricier to Build, Cheaper to Buy Than The Apple iPhone 6 Plus
Samsung Now Producing First M.2 NVMe PCIe SSD for PCs
Samsung to Make 14nm GPUs For Nvidia
Samsung to Release Proprietary Mobile Application Processor Core
Samsung Expects High Profit Ahead of S6 Launch
NVIDIA Receives Favorable Ruling from ITC in Patent Dispute with Samsung, Qualcomm
Samsung Reposnds To Press Reports
Samsung Relies More In Its Own Chips For Mobiles
Samsung Launches New SUHD and UHD Line Up

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .