Wednesday, October 22, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Microsoft Is Rolling Out First New Windows 10 Preview Build
Yahoo Reports High Revenue and Profit
New Samsung Galaxy S5 'Plus' Released With Faster Processor
Google, Facebook And Comcast Spend The Most On Lobbying
Google Play Music App To Follow Your Mood
Login To Google Using A USB Security Key
Toshiba Debuts New 2-in-1 Convertible PC with a 360-Degree Design
Acer Leads The Growing Chromebook Market
Active Discussions
Copied dvd's say blank in computer only
How to generate lots of different CDs quickly
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
 Home > News > PC Parts > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, November 01, 2006
Samsung Develops 16-Chip Multi-Stack Package Technology


Samsung announced today that it has developed the industry?s first process to enable production of a 16-chip multi-chip package (MCP) of memory.

Samsung?s new 16-chip MCP technology, when applied to 8Gb NAND flash chips, can enable up to a 16 gigabyte (GB) MCP solution.

Advanced multi-chip package technology requires a combination of key processes such as wafer thinning technology, redistribution layer technology, chip sawing technology and wire bonding technology.

To increase the number of chips stacked vertically, the need for further wafer thinning was a critical design obstacle. For the new 16-chip process, Samsung introduced wafer-thinning technology that eliminates 24 over 25 (24/25) of the thickness of each fabricated wafer to reduce the overall thickness to only 30-microns (um). This is just 65 percent the thickness of the 10-chip MCP wafer (45 um) Samsung developed in 2005 and similar to the size of a human cell, which measures 20 to 30 microns.



As part of its MCP technology, Samsung also developed a new laser-cutting technology to cut the wafer into individual chips. This new cutting process prevents the memory chips from breaking into pieces when they are cut using conventional blade sawing technology, which was originally designed only for sawing wafers up to 80 microns thick.

To vertically stack identically-sized dies (chips), a redistribution layer technology also is applied in Samsung?s new multi-stack MCP process, to enable wafer fabricators to adhere the wire contacts from just one side, unlike the conventional method of extending wire connection from both sides of each chip. Along with a single wire contact per die, the dies are placed in a zigzag stack to minimize the use of space and the length of the wire connectors. Moreover, the thickness of the adhesive has been reduced to 20 microns bringing the height of a 16-die stack to 1.4mm. (A 10-chip MCP uses a 60-micron adhesive layer and has a total height of 1.6mm.)

Samsung?s new 16-chip MCP was developed just one year after the development of the first 10-chip MCP. The new 16-chip MCP package technology provides the highest density solution yet developed for the creation of slimmer consumer electronics.


Previous
Next
Midway Ships Unreal Anthology for PC        All News        Nvidia GeForce 8800 Specs Leaked
Hitachi Unveils 2.5-inch Hard Drive Roadmap     PC Parts News      OCZ Expands SD Dual Product Line to Now Offer 133X Speeds

Get RSS feed Easy Print E-Mail this Message

Related News
New Samsung Galaxy S5 'Plus' Released With Faster Processor
SK Telecom and Samsung Join Hands to Lead 5G Network Technology
New 64-bit Exynos 7 Octa Processor Supports Iris Recognition
Samsung Claims 5G Speed Record
Facebook And Samsung Executives Discuss Mobile, Content Collaborations
Samsung SDI and LG Chem Showcase Advanced Batteries
Samsung Gevelops 5 Times Faster WiFi technology
Samsung Starts Mass Production of First 3-bit 3D V-NAND
Samsung Galaxy Tab Active Now Available For Pre-order
Samsung Announces Weak Q3 Guidance
Samsung to Build New Chip Plant In South Korea
Microsoft says Samsung owes Millions in unpaid Patent Royalties

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .