Friday, February 27, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Qualcomm Extends LTE to Unlicensed Spectrum to Enhance Mobile Experiences
Toshiba Develops Multicore SoC For Image-Recognition Applications
Samsung Says Semiconductor Technology Can Easily Scale Down to 5nm
Ericsson Sues Apple Over Patent Infringement
Net Neutrality Rules Passed by The FCC
Apple To Hold Watch Event on March 9
ARCHOS Expands Selection of Smartphones During Mobile World Congress
LG 's 2015 OLED And LED 4K ULTRA HD TVs Now Available in The U.S.
Active Discussions
burning
nvidia 6200 review
Hello
Burning Multimedia in track 0
I'm lazy. Please help.
sanyo e6 camera
need help on some cd burning...
Why Double Logins ?
 Home > News > PC Parts > Intel C...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, September 27, 2006
Intel Centrino Gets Multiple New Features And Improvements


At the heart of the platform, the Intel Core 2 Duo processor will deliver greater performance and power saving capabilities

Today Intel Corporation disclosed details of its next-generation Intel Centrino Duo mobile technology platform that will enable laptops to operate faster and with enhanced wireless communication capabilities. At the heart of the platform, the Intel Core 2 Duo processor will deliver greater performance and power saving capabilities.

The company also announced a unique interoperability program for upcoming 802.11n products, designed to ensure fast and seamless communications with a variety of Wi-Fi access points. The improvements are designed to take what are already the world?s best processors and Intel Centrino mobile technology to the next level.

"In the past, users have sacrificed one or more capabilities in order to have a mobile PC," said David Perlmutter, senior vice president and general manager of Intel's Mobility Group. "But in the last few years, Intel has taken mobile computing to new levels of performance, connectivity and battery life, so that mobility offers little or no compromises compared to desktop computing. We continue to strengthen and broaden the mobile experience, and our future products will expand the capabilities of people worldwide."

Perlmutter demonstrated the next generation Intel Centrino Duo mobile technology platform, which he said will improve upon the already unrivaled performance and great power efficiency of current Intel Centrino mobile technology notebooks. The platform, scheduled for introduction in the first half of next year, will improve upon the Intel Core 2 Duo processor by offering new power saving capabilities in the central processing unit (CPU) and a faster front-side bus from 667Mhz up to 800Mhz, enabling greater energy-efficient performance. New capabilities, such as longer residency in Enhanced Deeper Sleep low-power state and Dynamic Front Side Bus Switching, will help manage average power while delivering more performance.

The platform will contain a new Wi-Fi solution that will be compliant with the emerging 802.11n specification. To ensure optimal user experience with this solution before the 802.11n specification is officially approved, Intel has created an 802.11n interoperability program, working with leading access point vendors - including Buffalo, D-Link, Linksys and Netgear - to perform interoperability, performance, range and stability testing.

"Many 802.11n products currently on the market don't interoperate optimally with Wi-Fi networks," said Perlmutter. "We believe our 802.11n solution will offer the best balance of throughput and power efficiency on the market. Our robust program will help ensure optimal interoperability, something people expect from Intel Centrino mobile technology laptops. This interoperability program is designed to go beyond the already robust program announced by the Wi-Fi Alliance."

Perlmutter also announced that Intel, in collaboration with Nokia, will deliver integrated wireless broadband connectivity products utilizing Nokia's leading edge 3G technology for upcoming Intel Centrino Duo mobile technology platforms. This will further expand connectivity options for laptop users with the broad availability of 3G networks.

The next-generation Intel Centrino mobile technology platform will add many of the Intel vPro technology capabilities available today on business desktop PCs. Wireless Intel Active Management Technology will help to improve a company's information technology efficiency, asset management, system security and availability, ultimately lowering total cost of ownership. The new systems will also include Intel's innovative flash memory-based accelerator, enabling systems to resume productivity from hibernation and run multiple applications up to two times faster, save 0.4 watts of power in the hard drive, and boot faster. In addition, Intel will revamp its chipset with a new integrated graphics core, offering new levels of richness, realism, life-like effects and high-definition playback.

Intel continues to expand its product portfolio of mobile devices and announced the next Ultra Mobile PC platform will be available during the first half of next year. The CPU for this platform will consume approximately half the power of today's CPUs with approximately one-fourth the package size. This will enable smaller, cooler form factors with longer battery life and new usage models.


Previous
Next
Nokia Announce Three New Music Handsets        All News        Divx Announces 6.4 Beta 1 with 1080 support
Sony Introduces VAIO C Series Notebooks     PC Parts News      Lenovo Debuts Fleet of Intel Core 2 Duo ThinkCentre Desktop PCs

Get RSS feed Easy Print E-Mail this Message

Related News
Intel Introduces New Brand Levels for the Intel Atom Processor
Intel's 'Skylake' Chips Coming This Year
Intel Buys IoT Chip Maker Lantiq
Intel 5th Generation vPro Processors Released
Intel Releases New 20nm SSDs For Data Centers
Latest Intel Graphic Driver Adds Support For 4K, VP9 Video Playback
Intel Reports Revenue Jump
Intel CEO Unveils Curie Module For Wearable Solutions
Intel 5th Generation Broadwell Processors Arrive, Cherry Trail Shipping
Intel, IBM Follow Different Strategies On 14nm FinFET
Intel Unifies and Simplifies Connectivity for IoT
TSMC To Make Intel's SoFIA Handset Chips

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .