Tuesday, May 31, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Patriot Announces 2TB Ignite SSD
ASUS Presents Zenvolution at Computex 2016
MediaTek Introduces Pump Express 3.0 Battery Charging Solution
New ARM Cortex-A73 Processor Drives Efficiency, Performance For Mobile Designs
Plextor To Showcase Its Gaming Grade SSDs at Computex 2016
Nvidia's GeForce GTX 1080 Launches Wordlwide
Corsair Bulldog PC Is Seeking A Place In Your Living Room
Samsung Galaxy C5 and C7 Released In China
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > AMD's T...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, September 22, 2006
AMD's Torrenza CPU Socket Receives Industry Support


AMD today announced that its Torrenza Initiative is serving as a collaborative force toward achieving future processor socket compatibility in the server industry.

By leveraging the advantages of AMD64 with Direct Connect Architecture and HyperTransport(TM) technology, OEMs will be able to standardize on a Torrenza Innovation Socket for many of their current and future server platforms. This game-changing approach to server design will enable OEMs to consolidate server offerings for multiple processors to potentially a single platform, reducing datacenter disruption and deployment costs for customers. The Torrenza initiative is establishing AMD64 as the Open Innovation Platform.

Leading server OEMs that develop silicon or intend to design products uniquely enabled by the Torrenza Initiative, including Cray, Fujitsu Siemens Computers, HP, IBM, Dell and Sun Microsystems, have endorsed Torrenza as an open innovation initiative, and plan to evaluate the Torrenza Innovation Socket.

The Torrenza Innovation Socket enables OEMs who develop their own silicon to take full advantage of an x86 environment and the accompanying economics associated with packaging, chipsets and motherboard designs. OEMs will be able to contribute to and obtain the Torrenza Innovation Socket Specification and associated design documentation.


Previous
Next
Eclipse Helps CMC Expand into High-Density Mastering        All News        Xbox 360 to Offer 1080p HD Video Playback Without HDMI
Micron Introduces 1 Gigabit DDR3 Memory     PC Parts News      Flaming laptop a ThinkPad

Get RSS feed Easy Print E-Mail this Message

Related News
AMD Introduces the FirePro S7100X Hardware-Virtualized GPU for Blade Servers
AMD Radeon R3 SSDs Released
AMD and Nantong Fujitsu Microelectronics Close on Semiconductor Assembly and Test Joint Venture
AMD Launches Its Most Powerful Graphics Card
AMD Posts Low Quarterly Revenue
AMD FirePro W9100 Professional Graphics Card Comes With 32GB Memory
AMD Teases With Its 7th Generation Bristol Ridge Mobile APU
AMD's Processor Recommendations For VR by HTC and Valve
AMD New FirePro S9300 X2 Pro Graphics Card Is Powered By Two Fiji GPUs
AMD Touts Radeon Graphics Capabilities In The DirectX 12 Era
AMD XConnect Software Allows For Plug-and-play Connection Between Laptops And External GPUs
Computex To Mark The Launch of AMD's New Polaris And Nvidia's Pascal GPUs

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .