Wednesday, October 07, 2015
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Twitter 'Moments'To Highlight Best Tweets
Hololens, New Lumia Smartphones, Band, Surface Pro 4 and Surface Book Shined At Microsoft's Windows 10 Devices Event
Sharp Showcases Ultra HD Blu-ray Recorder, 8K TV at CEATEC 2015
EU Court Says EU-US Data Transfer Pact Is Invalid
New Roku 4 Streaming Player Supports 4K Resolution
Sharp Showcases RoboHon Mobile Robot At Ceatec
Skyworks to Buy PMC-Sierra for $2 Billion in Cash
Sony Semiconductor Solutions Corporation Established
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > PC Parts > AMD's T...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, September 22, 2006
AMD's Torrenza CPU Socket Receives Industry Support

AMD today announced that its Torrenza Initiative is serving as a collaborative force toward achieving future processor socket compatibility in the server industry.

By leveraging the advantages of AMD64 with Direct Connect Architecture and HyperTransport(TM) technology, OEMs will be able to standardize on a Torrenza Innovation Socket for many of their current and future server platforms. This game-changing approach to server design will enable OEMs to consolidate server offerings for multiple processors to potentially a single platform, reducing datacenter disruption and deployment costs for customers. The Torrenza initiative is establishing AMD64 as the Open Innovation Platform.

Leading server OEMs that develop silicon or intend to design products uniquely enabled by the Torrenza Initiative, including Cray, Fujitsu Siemens Computers, HP, IBM, Dell and Sun Microsystems, have endorsed Torrenza as an open innovation initiative, and plan to evaluate the Torrenza Innovation Socket.

The Torrenza Innovation Socket enables OEMs who develop their own silicon to take full advantage of an x86 environment and the accompanying economics associated with packaging, chipsets and motherboard designs. OEMs will be able to contribute to and obtain the Torrenza Innovation Socket Specification and associated design documentation.

Eclipse Helps CMC Expand into High-Density Mastering        All News        Xbox 360 to Offer 1080p HD Video Playback Without HDMI
Micron Introduces 1 Gigabit DDR3 Memory     PC Parts News      Flaming laptop a ThinkPad

Get RSS feed Easy Print E-Mail this Message

Related News
AMD FirePro Graphics Powers New Dell Precision Mobile Workstations
AMD To Cut 5 Percent of Its Workforce
AMD Introduces PRO A-Series Processors
AMD Expands Embedded Graphics Lineup
AMD, Mentor Graphics To Accelerate Development for x86 and ARM Environments
Quick look: AMD Radeon R9 Nano
AMD Zen architecture Pushed back For 4Q16
AMD Forms Radeon Technologies Group To Focus on Graphics
AMD To Showcase Broadcast Ecosystem Workflows at IBC 2015
AMD Radeon R9 370X Graphics Card Launched In Asia
AMD Radeon R9 Nano Graphics Card Shipping September 10th
AMD Showcases Graphics, Energy Efficient Computing and Die-Stacking Technologies At Hot Chips

Most Popular News
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .