Sunday, July 24, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Verizon Closer To Yahoo Deal
Lite-On Expands Its SSD Storage Manufacturing
Samsung Sues Huawei
Facebook's Aquila Maiden Flight Is A Reality
ASML Makes Progress on EUV
Google Keeps The Lead Pack In Federal Lobbying Expenditures
NVIDIA Titan X Video Card Coming in August For $1200
Shuttle Launches New Fanless Intel Skylake U Platform Media Players
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > AMD's T...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, September 22, 2006
AMD's Torrenza CPU Socket Receives Industry Support


AMD today announced that its Torrenza Initiative is serving as a collaborative force toward achieving future processor socket compatibility in the server industry.

By leveraging the advantages of AMD64 with Direct Connect Architecture and HyperTransport(TM) technology, OEMs will be able to standardize on a Torrenza Innovation Socket for many of their current and future server platforms. This game-changing approach to server design will enable OEMs to consolidate server offerings for multiple processors to potentially a single platform, reducing datacenter disruption and deployment costs for customers. The Torrenza initiative is establishing AMD64 as the Open Innovation Platform.

Leading server OEMs that develop silicon or intend to design products uniquely enabled by the Torrenza Initiative, including Cray, Fujitsu Siemens Computers, HP, IBM, Dell and Sun Microsystems, have endorsed Torrenza as an open innovation initiative, and plan to evaluate the Torrenza Innovation Socket.

The Torrenza Innovation Socket enables OEMs who develop their own silicon to take full advantage of an x86 environment and the accompanying economics associated with packaging, chipsets and motherboard designs. OEMs will be able to contribute to and obtain the Torrenza Innovation Socket Specification and associated design documentation.


Previous
Next
Eclipse Helps CMC Expand into High-Density Mastering        All News        Xbox 360 to Offer 1080p HD Video Playback Without HDMI
Micron Introduces 1 Gigabit DDR3 Memory     PC Parts News      Flaming laptop a ThinkPad

Get RSS feed Easy Print E-Mail this Message

Related News
Latest AMD Radeon Software Fixes PCI-e Power Draw Issues
AMD Launches the VR-ready Radeon RX 480 Graphics Card
Nvidia To Position The GTX 1060 Against New Radeon RX 480
AMD Zen Chipset Rumored To Have USB 3.1 Design Issue
AMD To Release Polaris 10 And Polaris 11 GPUs
AMD Provides Sneak Peek of Polaris-based Radeon RX 460 and RX 470 Graphics Cards
AMD Launches 7th Generation AMD A-Series APUs, Announces New Radeon RX GPUs, Demonstrates Upcoming Desktop Processor "Zen" Processor Core
AMD Introduces the FirePro S7100X Hardware-Virtualized GPU for Blade Servers
AMD Radeon R3 SSDs Released
AMD and Nantong Fujitsu Microelectronics Close on Semiconductor Assembly and Test Joint Venture
AMD Launches Its Most Powerful Graphics Card
AMD Posts Low Quarterly Revenue

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .