Monday, March 02, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
MWC: Zuckerberg Provides Update On Plan to Connect World
MWC: Panasonic Nubo Monitoring Camera Has 4G Connectivity
MWC: Alcatel Introduces HERO 2+ Phablet And IDOL 3 Smartphone
Google To Launch Wireless Service, Android Pay
HP to Buy Aruba Networks
MWC: Intel Launches New Mobile SoCs, LTE Solution
Jolla Introduces Sailfish OS 2.0
MWC: Fujitsu Develops Smartphone with Iris Authentication
Active Discussions
Need serious help!!!!
burning
nvidia 6200 review
Hello
Burning Multimedia in track 0
I'm lazy. Please help.
sanyo e6 camera
need help on some cd burning...
 Home > News > Games > IBM Shi...
Last 7 Days News : SU MO TU WE TH FR SA All News

Friday, September 08, 2006
IBM Ships Chips for Nintendo Console


IBM said on Thursday it has begun shipping the microchips for Nintendo's new Wii console.

Nintendo, which has said the Wii will be on store shelves in time for the holidays, has not provided a specific launch date or pricing for its widely anticipated new game machine.

Earlier this year, IBM and Nintendo signed a multi-year microchip production agreement to support the upcoming launch of Nintendo?s Wii video game console. The chip, code-named ?Broadway,? will deliver experiences not previously possible on video game consoles.

?The first chips are in our possession,? said Genyo Takeda, Senior Managing Director/General Manager, Integrated Research & Development Division, Nintendo Co., Ltd. ?Today?s milestone marks the final stage of our drive to reach both core and nontraditional gamers with an inviting, inclusive and remarkable gaming experience.?

Under the terms of the agreement, IBM will produce millions Power Architecture-based chips featuring IBM Silicon on Insulator (SOI) technology at 90 nanometers (90 billionths of a meter), based on the specifications of the custom design agreement previously agreed upon by the two companies. The chip is being produced at IBM?s 300mm semiconductor development and manufacturing facility in East Fishkill, N.Y.

Silicon on Insulator technology from IBM helps deliver to Nintendo a generous improvement in processing power while achieving a 20 percent reduction in energy consumption.

Microchips based on the Power Architecture are the electronic brain of devices large and small, and are inside automotive safety systems, printers, routers, servers and the world?s most powerful supercomputers.

The relationship between IBM and Nintendo dates to May 1999, when IBM announced a comprehensive technology agreement to design and manufacture the central microprocessor, often referred to as the ?Gekko? chip, for the Nintendo GameCube system from its Burlington, Vt., production facility.



The Wii will compete with new Microsoft's already released Xbox 360 and Sony Corp.'s upcoming PlayStation 3. Nintendo has said it plans to ship 6 million units of its new Wii by year end.


Previous
Next
GeCube Release RX1300XT Platinum- Overclockers? Edition        All News        BenQ Introduces New Large LCD TV, VA series ? VA421
Microsoft Japan to Launch Cheaper Xbox in November     Games News      EA's NASCAR 07 Ships Today

Get RSS feed Easy Print E-Mail this Message

Related News
IBM Unveils New Storage Solutions Based on Micron's Flash
IBM BigInsights Introduces Machine Learning With R
IBM Says Popular Dating Apps Are Vulnerable to Hackers
Cloud Cryptographic Algorithm Protects Personal Data
Nintendo Cuts Operating Profit Forecast On Slack 3DS Sales
IBM Posts Fourth-quarter Results
Nintendo To Discontinue The Club Nintendo Rewards Program
Wii U Closes 2014 With Strong Sales
New 3DS XL Launches Next Month In The US
IBM Launches Powerful z13 Mainframe
IBM Retains U.S. Patent Record in 2014
Intel, IBM Follow Different Strategies On 14nm FinFET

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .