Monday, December 05, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Amazon Go Eliminates Checkout Lines In Stores
Uber Creates AI Lab With Geometric Intelligence Acquisition
Google Launches New Personal Safety App
Micron Introduces The TLC-based 5100 Enterprise SSDs
Panasonic May Buy Headlight Manufacturer ZKW
KAIST Sues Samsung, Qualcomm And Globalfoundries Over FinFET Patent Infringement
Samsung Offers Second Gear S2 Update
Google DeepMind Makes AI Training Platform Available On GitHub
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Consumer Electronics > New Gpo...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, May 10, 2006
New Gpoup Simplifies Flash NAND Integration


Hynix Semiconductor, Intel Corporation, Micron Technology, Phison Electronics Corporation and Sony Corporation are among the founding companies that today announced the formation of the Open NAND Flash Interface (ONFI) Working Group.

The mission of the ONFI Working Group is to simplify integration of NAND flash memory into consumer electronics (CE) devices and computing platforms. The companies are jointly defining an enhanced chip-level standard interface for the attachment of NAND flash memory to host systems.

Today, use of NAND flash in CE devices and computing platforms is hampered by the lack of sufficient standardization. To support a new NAND flash part on a platform, host software and hardware changes are often required, even when the new NAND flash part is supplied by the same vendor. Implementing host changes can be extremely costly due to the new testing cycle required and can cause slower rates of adoption for new NAND flash devices.

?An improved common interface is critical to reducing or eliminating software changes and long qualification cycles when using a new NAND flash part,? said Takashi Yamanishi, Deputy General Manager, Standards and Partnership, Sony Corporation.

To enable a fast industry transition to the new interface, ONFI will exploit existing commonalities between current NAND devices. The interface will enable NAND devices to self-describe their capabilities to the host, including memory layout, timing support and enhanced features. The specification will also standardize the command set for NAND, put infrastructure in place for future evolution of NAND capabilities, and provide flexibility for supplier-specific optimizations. Additionally, the specification will define common pin-outs in order to avoid board layout changes when using a new NAND device.

The group continues to work with other industry-leading companies, including NAND suppliers, to form the board of directors. Additional founding members are expected to be announced within the quarter as the process is completed. The specification is scheduled to be completed by the ONFI Working Group in the second half of 2006.


Previous
Next
Nokia Launches New Mid-range Sports Phone        All News        RITEK Introduces New Line up of Storage Media Products at Computex
JVC Launches New Everio 3-CCD Flahship Hard Disk Camcorder     Consumer Electronics News      Acer Targets Gamers with New 2ms LCD Display

Get RSS feed Easy Print E-Mail this Message

Related News
A Closer Look At SK Hynix's 3D NAND
SK hynix To Start Mass Production Of 48-layer 3D-NAND Chips
Toshiba Expands 3D Flash Memory Production Capacity In New Fabrication Facility at Yokkaichi
NAND Flash Prices on Upswing in Fourth Quarter Due To Supply Shortage
Samsung to Start Making 64-layer 3-D Flash memory for Smartphones
Toshiba Expands 24nm SLC Flash Family with 16Gb Offering
Micron Announces QuantX Branding For 3D XPoint Memory, Releases 3D NAND flash for Mobile Devices
Toshiba Announces New BG SSDs with 3-Bit-Per-Cell TLC BiCS FLASH
Western Digital Announces First 64 Layer 3D NAND Technology
Toshiba To Produce First 64-layer 3D NAND Flash Memory Chip
China To Invest In 3D NAND Flash Plant
Samsung Showcases New BGA, Enterprise And Consumer SSDs

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .