Tuesday, May 30, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
New Ballistix Tactical Tracer DDR4 Gaming Memory Modules Get RGB Lighting
SK Hynix and Micron Try To Catch up With Samsung in 10nm DRAM Production
CORSAIR Unveils Concept Curve, Concept Slate, SYNC IT and Host of New Liquid Cooling Options at COMPUTEX
Computex 2017: Dell Debuts Inspiron AIOs and VR Gaming Desktop
Samsung Announces New Virtual Reality Partnerships with UFC, X-Games and Live Nation
Computex: Qualcomm Unveils Mesh Networking Platform and Reference Design
Computex: GeForce Partners Unveil Over 40 New Products based on NVIDIA's Max-Q Design
Computex: Western Digital to Deliver First Client Solid State Drives with 64-Layer 3D NAND Technology
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Consumer Electronics > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, April 05, 2006
Toshiba, SanDisk to Build new NAND Flash Memory Facility


Toshiba and SanDisk said in a joint statement they have agreed to build a new 300-millimeter wafer fabrication facility to meet fast growing demand for NAND flash memory chips.

NAND flash memory chips are widely used in mobile and digital consumer products, such as MP3 music players.

The two said the decision should enhance their leading position in the fast-growing storage device market.

The companies plan to start building the new facility at Toshiba's Yokkaichi plant in August 2006, with production slated to begin in the fourth quarter of 2007.

Toshiba will fund construction of the building, while both it and SanDisk will provide funds for the manufacturing equipment.

The two did not disclose the amount of investment planned for the new facility nor the production capacity, saying these details are subject to further negotiation.

The Nihon Keizai Shimbun reported recently that Toshiba is likely to spend around 500 bln yen to build a new plant capable of making 100,000 300mm wafer equivalent chips each month.

Toshiba currently makes 30,000, 300mm wafers a month and 107,500, 200mm wafers a month.

According to a recent survey by US firm iSuppli, the global market for NAND-type flash memory chips grew 64 pct last year to be worth 10.8 bln usd, with the main players being Toshiba with a 21.9 pct share and Samsung Electronics with 52.9 pct.


Previous
Next
Microsoft Invests in Wireless DRM        All News        VIA Launches First Single-Chip Embedded Chipset, the VIA CX700, at ESC 2006
New JVC LCD TVs     Consumer Electronics News      New Sony WALKMAN MP3 Players

Source Link Get RSS feed Easy Print E-Mail this Message

Related News
Computex: Western Digital to Deliver First Client Solid State Drives with 64-Layer 3D NAND Technology
Samsung Electronics Is Considering Adding Second 3D NAND Line in China
New Toshiba XG5 of NVMe SSDs are Using 64-Layer 3D Flash Memory
Western Digital Raises its Offer For Toshiba's Memory Business: report
Broadcom, KKR and SK Hynix - Bain Join Final Bidding Round for Toshiba's Memory Unit
Western Digital Takes Legal Action Against Toshiba to Block Sale Of Memory Chip Business
Toshiba Tells Western Digital To Stop Messing Up With Chip Unit Sale
Toshiba Demonstrates 64-Layer BiCS FLASH on Client NVM Express SSD
Western Digital Introduces iNAND 7250A Embedded Storage Device
3D-NAND to Become Mainstream This Year
Toshiba to Spin Off 4 Operations
Questions Remain About The Fate Of Toshiba's HDD and SSD Business

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .