Tuesday, July 25, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
LG Display Outlines $13.5 billion OLED Investment Plan
Microsoft Paint isn't Dead Yet
SK hynix Reports Record Q2 Results on Strong Chip Sales
Alphabet Earns More Cash Despite Antitrust Fine
Spotify Close to Deal With Warner - sources
Western Digital Announces Four-bits-per-cell Technology On 3D NAND
Samsung Galaxy J3 and J7 are now Unlocked
Second Version of HoloLens HPU Will Incorporate AI Coprocessor For implementing DNNs
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > AMD And...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, December 07, 2005
AMD And IBM Unveil 65nm Process Technologies


In papers presented at the International Electron Devices Meeting (IEDM) in Washington, D.C., IBM and AMD today detailed their progress in bringing advanced semiconductor process technologies and materials to the 65 nanometer technology generation.

The companies announced that they have successfully combined embedded Silicon Germanium (e-SiGe) with Dual Stress Liner (DSL) and Stress Memorization technology (SMT) on Silicon-On-Insulator (SOI) wafers, resulting in a 40 percent increase in transistor performance compared to similar chips produced without stress technology, while controlling power consumption and heat dissipation. The new process technologies reduce interconnect delay through the use of lower dielectric constant (lower-K) insulators, which can improve overall product performance and lower power consumption. In addition, the new technologies have shown ability to be manufactured at the 65nm generation and scaleable for use in future generations.

Additional details about third generation strain technology innovations from AMD and IBM will be disclosed at the 2005 IEEE International Electron Devices Meeting, December 5-7, 2005 in Washington, D.C. This technology was developed as part of the AMD and IBM joint development alliance at AMD?s fabrication facilities in Dresden, Germany, and at the IBM Semiconductor Research and Development Center in East Fishkill, N.Y.


Previous
Next
Thomson, Taiwan's BenQ Settle Dispute Over LCD Screens, TV Patents        All News        Mediatek Offers DivX Certified IC Solutions
New Chip Materials Extend Moore's Law     PC Parts News      Sony and Toshiba Develop Technologies for Enhanced 45nm Generation System LSI

Get RSS feed Easy Print E-Mail this Message

Related News
IBM Z Mainframe Features Pervasive Data Encryption
AMD Tests Memory Overclocking On Ryzen Systems
AMD's 16-core Threadripper Arrives Next Month for $999
AMD Unveils AMD4U for Gamers and Content Creators with Square Enix and Adobe
AMD Launches the Ryzen Pro Processors For Business PCs
AMD Radeon Vega Frontier Edition Launches for $1,000
AMD Takes on Intel With Epyc Server SoCs For the Data Center
AMD Details the New Radeon Pro Chips Inside Apple's 2017 Macs
Researchers Say Silicon Nanosheets is the Path to 5nm Transistors
Computex: AMD Demonstrates Upcoming Ryzen and Vega-based Products
AMD Ryzen AGESA 1.0.0.6 Firmware to Enable Speedy Memory Clocks
AMD Radeon RX 560 Released

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .