Wednesday, June 29, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Western Digital My Passport Line Now In Capacities of Up To 4TB
IBM Scientists Discover New Recycling Process to Convert Old Smartphones and CDs into Non-Toxic Plastics
Amazon Page Flip Offers A New Way to Hop, Skim, and Jump through Kindle Books
NTT Uses Light Reflection To Create Faster Encryption Technique
New LG Projector Creates An 80-inch screen in Short Distance
Researchers Unveil New Data Replication Method for Disaster-resilient Information Platforms
Dell 78-inch Monitor, Full HD projectors And The Dell Classroom Software for Chromebooks
Nvidia To Position The GTX 1060 Against New Radeon RX 480
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > PC Parts > AMD And...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, December 07, 2005
AMD And IBM Unveil 65nm Process Technologies


In papers presented at the International Electron Devices Meeting (IEDM) in Washington, D.C., IBM and AMD today detailed their progress in bringing advanced semiconductor process technologies and materials to the 65 nanometer technology generation.

The companies announced that they have successfully combined embedded Silicon Germanium (e-SiGe) with Dual Stress Liner (DSL) and Stress Memorization technology (SMT) on Silicon-On-Insulator (SOI) wafers, resulting in a 40 percent increase in transistor performance compared to similar chips produced without stress technology, while controlling power consumption and heat dissipation. The new process technologies reduce interconnect delay through the use of lower dielectric constant (lower-K) insulators, which can improve overall product performance and lower power consumption. In addition, the new technologies have shown ability to be manufactured at the 65nm generation and scaleable for use in future generations.

Additional details about third generation strain technology innovations from AMD and IBM will be disclosed at the 2005 IEEE International Electron Devices Meeting, December 5-7, 2005 in Washington, D.C. This technology was developed as part of the AMD and IBM joint development alliance at AMD?s fabrication facilities in Dresden, Germany, and at the IBM Semiconductor Research and Development Center in East Fishkill, N.Y.


Previous
Next
Thomson, Taiwan's BenQ Settle Dispute Over LCD Screens, TV Patents        All News        Mediatek Offers DivX Certified IC Solutions
New Chip Materials Extend Moore's Law     PC Parts News      Sony and Toshiba Develop Technologies for Enhanced 45nm Generation System LSI

Get RSS feed Easy Print E-Mail this Message

Related News
IBM Scientists Discover New Recycling Process to Convert Old Smartphones and CDs into Non-Toxic Plastics
Nvidia To Position The GTX 1060 Against New Radeon RX 480
AMD Zen Chipset Rumored To Have USB 3.1 Design Issue
AMD To Release Polaris 10 And Polaris 11 GPUs
AMD Provides Sneak Peek of Polaris-based Radeon RX 460 and RX 470 Graphics Cards
AMD Launches 7th Generation AMD A-Series APUs, Announces New Radeon RX GPUs, Demonstrates Upcoming Desktop Processor "Zen" Processor Core
AMD Introduces the FirePro S7100X Hardware-Virtualized GPU for Blade Servers
IBM Watson Will Be Trained To Tackle Cybercrime
IBM and SK Holdings C&C Alliance Brings Watson To South Korea
AMD Radeon R3 SSDs Released
IBM Makes Quantum Computing Available on IBM Cloud
AMD and Nantong Fujitsu Microelectronics Close on Semiconductor Assembly and Test Joint Venture

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .