Wednesday, November 26, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Samsung's DeepSort Sorting Engine Prevails In Benchmarks
Sony Plans E-Paper Watch: report
HP Reports Fiscal 2014 Full-Year and Fourth Quarter Results
Hitachi Wearable Device Monitors Brain Functions
Hitachi Technology Stores Digital Data In 100 Recording Layers, Data Can be Stored For 300 million Years
Sony To Provide Refunds To Users Over Misleading Ads For PlayStation Vita
Blu-ray Movie Discs Used As Templates For Improving Solar Cell Performance
PC Outlook Remains Cautious
Active Discussions
Hi All!
cdrw trouble
CDR for car Sat Nav
DVD/DL for Optiarc 7191S at 8X
Copied dvd's say blank in computer only
Made video, won't play back easily
New Features In Firefox 33
updated tests for dvd and cd burners
 Home > News > PC Parts > Carbon ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, December 06, 2005
Carbon Nanotube Heatsinks by Fujitsu


Fujitsu has developed a carbon nanotube-based package of heatsinks for semiconductor chips. The company plans to use them in high-frequency, high power amplifiers for next-generation mobile communication systems.

According to the company, the new technology represents a major step forward in developing practical applications that take advantage of the superior thermal conductivity of carbon nanotubes. It also enables the realization of high-performance amplifiers with high frequency and high power for next-generation mobile communication systems.

Fujitsu's new technology enables the simultaneous achievement of high amplification and heat dissipation, in high-frequency, high power amplifiers. The company has succeeded in the world's first application of carbon nanotubes, which are claimed to have excellent thermal conductivity, for the bumps in a flip-chip structure.

Conventionally, heat was dissipated through the use of what is known as a "face-up structure", in which a high power transistor device would be connected directly dice-bonded to the package.

At higher frequencies, amplifiers using the face-up structure suffer from reduced amplification due to an increase in inductance from the metal wire through which the electrical current flows from the chip to the package.

One solution is to flip over the chip and connect the chip and the package with short metallic bumps made from gold or other metals in a "flip-chip structure".



However, for use in high power amplifiers, conventional metallic bumps have proven inadequate in dissipating the high levels of heat generated by high-power transistors. For these reasons, it has been difficult to develop high-performance amplifiers that can satisfy both high-amplification and heat dissipation at high frequencies. Fujitsu's new nanotube-based packaging technique solves that problem.

To produce the heat sink package, Fujitsu engineers first grow carbon nanotubes to a vertical length of at least 15 micrometers on the wafer substrate. Usually, bumps for flip-chips are required to have a length of at least 10 micrometers.

Carbon nanotubes have thermal conductivity of 1400W/(m-K) -- a level much higher than that of metal, and because it is possible to connect carbon nanotube-based bumps very near to the heat-generating miniature electrodes, Fujitsu successfully achieved the high amplification of flip-chips with heat dissipation levels equivalent to face-up structures.

Compared to conventional face-up structures, ground inductance is reduced by more than half, thereby enabling an increase in amplification of at least 2 decibels at high frequencies of 5GHz or greater.

Fujitsu believes that it will be able to deploy the new technology in base stations for next-generation mobile communication systems in around three years? time.

For additional information and technical details, visit http://www.fujitsu.com.


Previous
Next
Sony's DVDirect Recorder Burns DVD Discs Without a Computer        All News        Xbox 360 Available Outside Japan Early 2006
Sony and Toshiba Develop Technologies for Enhanced 45nm Generation System LSI     PC Parts News      ATI Delivers 12 Pixel Shaders To Notebook PCs

Get RSS feed Easy Print E-Mail this Message

Related News
Fujitsu Develops LED Lighting Technology that "Shines" Data on Objects
Fujitsu Develops Design Technology for Allocating LTE-Advanced Base Stations
Fujitsu Launches Petabyte-scale New Hyper-scale Storage ETERNUS CD10000
Fujitsu Boosts Lineup of Smartphones and Tablets for the Enterprise
Fujitsu Develops Fast Recovery Process for Multiple Disk Failures
Fujitsu Relases New Extreme Series SSDs
Fujitsu, NTT, and NEC To Commercialize 400Gbps-class Optical Transmission Technology
Fujitsu, Panasonic Announce New Direction for Their Semiconductor Businesses
Fujitsu To Phase Out Chip Production
Fujitsu Technology Reduces Network Switches in Cluster Supercomputers
New Fujitsu ARROWS Tab Q335/K Tablet Coming In October
Fujitsu Buys Shares of Panasonic Information Technology Solutions

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .