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Wednesday, October 26, 2005
OCZ Products to Implement New Heatspreader Design


The new OCZ PC-3200 and PC-3500 Gold GX series modules will be the first two products to utilize the latest OCZ heatspreader design.

The new, patent-pending XTC (Xtreme Thermal Convection) Heatspreaders allow increased ventilation and heat dissipation due to a honeycomb design.

The design used in the XTC heatspreaders optimizes the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs.



?Memory modules that implement conventional, solid heatspreaders provide sufficient heat dissipation but do not adequately address the build up of heat pockets; The new Xtreme Thermal Convection Heatspreader design tackles this problem and more," commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. "Our goal is to get rid of the thermal load as quickly and efficiently as possible. A honeycomb perforation contour promotes the physical escape of hot air from the space in between the individual memory components, thus enhancing the performance of the high performance Gold GX series and preserving the life of the ICs and future parts to come.?

The PC-3200 and PC-3500 Gold Gamer eXtreme Series with 2-2-2-5 timings will be the first OCZ memory parts to include the new XTC heatspreader.

The PC-3200 & PC-3500 Gold GX XTC series will be available in 512MB modules and 1GB (2x512) dual channel optimized kits. All OCZ memory solutions come backed with a lifetime warranty and toll-free technical support.


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