Saturday, December 03, 2016
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Apple Blames Battery For Random iPhone 6s Shutdowns
Microsoft Stores Reveal Xbox Discounts And Offers
Researcher Bypasses The iOS Activation Lock
Facebook To Offer $20 million To Improve Silicon Valley Communities
Xiaomi Launches Voice -controller Mi Wi-Fi Speaker
Xiaomi "Denies" Mi MIX Nano Existence
Nokia D1C Specs Leak
Foxconn Manager Stole Thousands of iPhones
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Digital Cameras > Sharp D...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, June 28, 2005
Sharp Develops Ultra Compact LSI for Digital Cameras


Sharp claims an industry first with the developement of 0.5-mm ball pitch technology for 3D System in Package (SIP).

Sharp will begin trial shipment of two system LSIs for digital still cameras, the LR38683 and LR38682, in June 2005, with mass-production to start in July.

With an increasing number of functions in portable products like digital still cameras and mobile phones and a strong demand for smaller and thinner profiles, the need for fewer parts and reduced mounting surfaces is growing.

This latest 3D SIP from Sharp stacks multiple ICs at a ball pitch of 0.5-mm, thus allowing for drastic reduction in mounting surface.

In the first use of this technology, Sharp has mounted a compact 3D SIP of DSP, flash memory, and SDRAM at a ball pitch of 0.5 mm. Compared to the 2-package stack, formerly the industry norm, mounting surface has been reduced by 42%, contributing to digital still cameras that are lighter and thinner.

LR38683
Applicable devices: DSP, 32Mb flash memory, 256Mb SDRAM X 2
Start of sample shipment: End of June 2005

LR38682
Applicable devices: DSP, 32Mb flash memory, 256Mb SDRAM X 1
Start of mass-production: July 2005

Main Features
1. 0.5-mm ball pitch for an approximate 42% reduction in mounting space This 3D SIP makes it possible to stack DSP, flash memory, and SDRAM in one package.

2. Conducive to flexible system design
This new technology makes it possible to put logic and memory ICs in the same package, something difficult to do with previous SIP technology. As well, it?s possible to change the memory configuration depending on the needs of the system, such as the number of pixels of the CCD.


Previous
Next
Microsoft Collaborates With Japanese Universities        All News        Apple Updates iTunes Music System, Adds Podcast
The New Olympus C-315 Zoom     Digital Cameras News      Samsung Launches 5Mega-pixel CIS for Mobile Handheld Devices

Get RSS feed Easy Print E-Mail this Message

Related News
Sharp Forecasts Annual Profit, Introduces New Corporate Motto
Next Generation iPhones To Have OLED Screens, Sharp President Confirms
CEATEC 2016: Sharp Showcases 27-inch 8K 120Hz IGZO Monitor, 5.2-inch Full HD Curved Display
Foxconn's Sharp to Invest $570 Million on Flexible OLED Panel Production
Foxconn Completes Sharp Acquisition
Foxconn's Wu Becomes Sharp's New President
Hon Hai To Jointly Develop TVs With Sharp
Sharp's RoBoHoN Phone Goes On Sale
Sharp Showcases Flexible OLED Panel
Hon Hai, Sharp Sign Takeover Deal
Hon Hai Group To But Majority Stake Of Sharp For 388.8 Billion Yen
A Sharp - Foxconn Deal Is Near

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2016 - All rights reserved -
Privacy policy - Contact Us .