Kyocera has developed a compact wireless LAN (WLAN) module for mobile phones. The module, which measures 9.8 mm x 7.5 mm x 1.5 mm, is a world's smallest class WLAN transceiver that supports IEEE802.11g.

Among those in the same category, Murata Manufacturing Co., Ltd.'s product measuring 9.6 mm x 9.6 mm x 1.8 mm, released in 2004, has been the smallest. Target customers are development manufacturers of mobile phones featuring WLAN capability.

The module was presented at a workshop of the IEEE MTT-S International Microwave Symposium 2005 (IMS2005) event held at Long Beach, California, US from June 11, 2005. Kyocera reduced the module size by integrating components such as a transceiver IC and a filter onto a low-temperature co-fired ceramic (LTCC) substrate. The company applied its technologies fostered in the development of RF circuitry components for mobile phones to the WLAN module.

Components integrated onto the LTCC substrate include an RF transceiver IC, a MAC/baseband processor LSI, an RF switch, a power amplifier, an LNA, a band pass filter and a balun. The company uses an RF transceiver incorporated with a power amplifier for data transmission. The name of the WLAN chipset manufacturer has not been disclosed. Kyocera had previously announced another IEEE802.11b compact WLAN module, which measured 9.0 mm x 7.0 mm x 1.5 mm, at an exhibition held in Japan in October 2004.