Kyocera has developed a compact wireless LAN (WLAN) module for mobile phones. The module, which measures 9.8 mm x 7.5 mm x 1.5 mm, is a world's smallest class WLAN transceiver that supports IEEE802.11g.
Among those in the same category, Murata Manufacturing Co., Ltd.'s product measuring
9.6 mm x 9.6 mm x 1.8 mm, released in 2004, has been the smallest. Target customers
are development manufacturers of mobile phones featuring WLAN capability.
The module was presented at a workshop of the IEEE MTT-S International Microwave
Symposium 2005 (IMS2005) event held at Long Beach, California, US from June 11, 2005.
Kyocera reduced the module size by integrating components such as a transceiver IC
and a filter onto a low-temperature co-fired ceramic (LTCC) substrate. The company
applied its technologies fostered in the development of RF circuitry components for
mobile phones to the WLAN module.
Components integrated onto the LTCC substrate include an RF transceiver IC, a
MAC/baseband processor LSI, an RF switch, a power amplifier, an LNA, a band pass
filter and a balun. The company uses an RF transceiver incorporated with a power
amplifier for data transmission. The name of the WLAN chipset manufacturer has not
been disclosed. Kyocera had previously announced another IEEE802.11b compact WLAN
module, which measured 9.0 mm x 7.0 mm x 1.5 mm, at an exhibition held in Japan in