Friday, November 27, 2015
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
NSA's Phone Surveillance Program Changes
Lenovo and Razer Partner to Make Gaming PCs
LG Display Makes Huge Investment in OLED Panels
Sony To Bring Remote Play Feature To PS4
MINIX NEO U1 Media Hub for Android Coming Next Week
Samsung Joins Audi’s Progressive SemiConductor Program
German ISPs May Block Music-sharing Sites: court
Study Says HTTPS Certificate and SSH Key Reuse Endangers Millions of Devices Worldwide
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > PC Parts > Toshiba...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, June 15, 2005
Toshiba, Sony Jointly Develop 45 nm Embedded DRAM Technology

At the 2005 Symposium on VLSI Technology event, Toshiba Corp. and Sony Corp. announced an embedded DRAM process technology, which they have jointly developed at the 45 nm node.

The companies achieved the cell size of 0.069 μm2 by introducing the following three key techniques.

Firstly, Toshiba and Sony expanded the trench bottom area using technology called bottle etching, while introducing high-permittivity Al203 coating for capacitor insulation. Capacitor volume per unit area has been boosted 60% as a result, and the companies secured the capacitor volume equivalent to that of an obsolete model, while reducing the size of a capacitor.

Secondly, the companies employed a hybrid architecture combining spin on dielectric (SOD) and high-density plasma Si02 coating for trench isolation. This architecture eased STI response, reduced joint leakage and improved charge retention property. The technology also enabled to embed high aspect ratio STI devices more easily than before.

Lastly, Toshiba and Sony used Ultra Shallow Buried Strap technology, which forms Ni-salicide at joints (straps) between capacitors and transistors. This technology reduced the dimensions of a strap part and removed additional processing previously needed for conventional process technology.

Microsoft Post RAW Thumbnailer and Viewer        All News        Rambus to License XDR Technology to IBM
Toshiba Announces Portable and Stylish 17" Notebook     PC Parts News      Rambus to License XDR Technology to IBM

Get RSS feed Easy Print E-Mail this Message

Related News
Sony CEO dismisses Chip Development Rumors
Toshiba Takes Former Executives To Court
Sony a68 A-mount Camera Shipping With 4D FOCUS
Sony Returns To profitablity Following Strong PS4 Sales
Toshiba To Sell Image Sensor Business to Sony
Toshiba and SanDisk Start Equipment Installation at Yokkaichi’s New Fab 2
Toshiba Unveils New Enterprise Performance HDD
Sony Introduces 4K Home Theater Projectors, ES Receiver at CEDIA 2015
Sony RX1R II Camera Packs A 42MP Back-Illuminated Full-Frame Image Sensor
Samsung Maintains Highest DRAM Market Share in Q2
Toshiba Introduces Windows 10 dynaPad Tablet, dynabook Notebooks
Sony Acquires Softkinetic Systems To Expand Its Image Sensor Offerings

Most Popular News
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .