Tuesday, September 30, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Google Offers Unlimited Cloud Storage To Students
Gionee Announced The World's Thinnest Smartphone
MPEG LA Rolls Out HEVC License
PayPal To Become An Independent Publicly Traded Company in 2015
AMD To Showcase ARM Cortex-A57-Based Hadoop on Opteron Processors
SanDisk Introduces New X300 SSD And Client SSD Upgrade Service For Corporate Environments
TSMC and ARM Announce 16nm FinFET Silicon with 64-bit ARM big.LITTLE Technology
Google To Unveil New Music Services
Active Discussions
Yamaha CRW-F1UX
help questions structure DVDR
Made video, won't play back easily
Questions durability monitor LCD
Questions fungus CD/DVD Media, Some expert engineer in optical media can help me?
CD, DVD and Blu-ray burning for Android in development
IBM supercharges Power servers with graphics chips
Werner Vogels: four cloud computing trends for 2014
 Home > News > PC Parts > Rambus ...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, June 15, 2005
Rambus to License XDR Technology to IBM


Rambus Inc. has given IBM a license to use its XDR memory controller interface cell, dubbed XIO.

This agreement enables IBM to provide an advanced, high-speed design for high-performance consumer applications utilizing its 90-nm ASIC process.

The XIO cell from Rambus is a high-performance, low-latency controller interface to XDR DRAM memory sub-systems. The CMOS macro cell can be seamlessly integrated into a wide variety of target processes. It provides a wide, on-chip, CMOS-level signaling interface to the memory controller logic and a narrow, high-speed Differential Rambus Signaling Level (DRSL) interface to the external XDR memory system.

"Rambus has a long history of designing and delivering very high speed, advanced interface designs that have been broadly used in the industry," said Tom Reeves, vice president of IBM's Semiconductor Products and Solutions, in a statement. "We have worked with them on several projects and are pleased to build upon our existing relationship with this new agreement."


Previous
Next
Toshiba, Sony Jointly Develop 45 nm Embedded DRAM Technology        All News        DivX 6 Enters the Market with Enhanced Performance, Editing
Toshiba, Sony Jointly Develop 45 nm Embedded DRAM Technology     PC Parts News      MSI Expects Monthly Mobo Shipments to Grow 50% in 2H

Get RSS feed Easy Print E-Mail this Message

Related News
Rambus Signs License Agreement with Qualcomm
Rambus and Nanya Sign Patent License Agreement
Rambus CMOS Sensor Fits In Cameras Without Lens
Rambus Signs Agreement with Samsung
Rambus Settles Patent Disputes With Micron
Rambus Signs Agreement with STMicroelectronics
Rambus and SK Hynix Sign Patent License Agreement
Rambus Pleased With Court Ruling In SK Hynix Case
Rambus Demonstrates the Imerz IPTV Multi-Media Platform, Binary Pixel Technology at MWC
Rambus and LSI Sign Patent License Agreement
Rambus Introduces R+ LPDDR3 Memory Solution
Rambus and Fujitsu Sign Patent License Agreement

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .