Royal Philips Electronics (NYSE:PHG) (AEX:PHI) today announced that Samsung has selected the Philips low-power 802.11 Wireless Local Area Networks (WLAN) solution for its new line of mobile phones.
The Philips 802.11 solution offers easy access to public WLAN access points, corporate networks and wireless home networks so consumers can effortlessly connect to information, entertainment and services.
With the growth of mobile handset applications moving beyond voice calls to camera functionalities, MP3 music, FM radio, gaming and multimedia applications, consumers are increasingly using their mobile phone as the focal point for communications. By using WLAN-equipped mobile handsets, consumers can enjoy simple, wireless connectivity and take advantage of seamless access to voice, data and multimedia content through the existing WLAN networks.
"Mobile users expect to connect in a reliable and secure manner when they are using a WLAN-capable cell phone to link to hotspots," said Allen Nogee, principal analyst with industry research firm In-Stat. "Philips' proficiency in developing extremely low-power WLAN solutions shows a commitment to deliver products that meets the growing consumer demand for wireless connectivity."
"Samsung mobile phones lead the market with superior technology and innovative features that simplify on-the-go wireless connectivity for consumers," said Paul Marino, vice president and general manager, Business Line Connectivity, Philips Semiconductors. "We are very pleased that Samsung has chosen our mobile WLAN solution to connect consumers to the growing number of WLAN networks -- in the home, at work and on the go."
The low-power 802.11 WLAN semiconductor solution from Philips delivers the industry's lowest standby power consumption that utilizes less than 2 milliwatts (mW) and a radio performance that delivers up to +18 dBm at the antenna port, which is 6 dBm more than competing solutions. These capabilities enable a long-lasting, high-quality wireless networking experience for users. The Philips solution can be implemented in less than a 150 mm(2) of printed circuit board area -- allowing significant space savings in next-generation mobile phones.