Ultra-thin sound panels and world's smallest headphone set new standards for portable audio
Royal Philips Electronics (NYSE: PHG, AEX: PHI) today unveiled two new products that enable OEM manufacturers to enhance the consumer experience of multimedia on the move. The first, the company's new ultra-thin sound panel technology, gives mobile device and audio manufacturers the freedom to design innovative and inspiring sound accessories while combining low power consumption with superior audio quality. Providing on-ear headphone quality in the world's smallest in-ear design, the second new addition to Philips' range of audio solutions is a high-performance stereo headphone - an ideal accessory for the latest generation of cellular phones, as well as for music players, mobile video systems and gaming devices.
Growth in 3G subscriber numbers and the increasing availability of downloadable audio and video content is fuelling consumer demand for a high-quality audiovisual experience. Combined with the increasing use of portable audio, video and gaming devices that provide a compelling multimedia experience on the move, manufacturers are faced with the challenge to develop increasingly sophisticated audio accessories that look as good as they sound. Philips' new sound panel and headphone technologies address this need, delivering on the consumer's desire for sound quality while meeting the advanced design needs of manufacturers.
"With the increasing use of broadband connectivity in mobile devices and the availability of sophisticated multimedia features in cellular phones, the demand for an exciting, high-quality mobile audio experience has never been greater," said Ernst M?llner, general manager, Philips Sound Solutions, Philips Semiconductors. "These new products confirm our leadership in mobile audio technologies, enabling our customers to develop exciting audio solutions that deliver both effective design and a superior user experience."
With the core miniature speaker components measuring 8-15 mm in diameter, the technology underpinning the sound panels is extremely scalable, making it possible to deliver the product in many different sizes and designs. Additionally, the panels provide sound projection features, giving users the option to direct the sound generated. With an extremely flat frequency curve, the panels have produced excellent ratings for sound pressure level (SPL) and total harmonic distortion (THD).
The headphone measures only 13 mm in diameter, at least 2 mm less than competing products. To reduce time-to-market, its modular format simplifies development while offering maximum design flexibility. With the speaker functions isolated in a standalone acoustic module, OEMs are given complete control over the exterior earpiece's design, finish and color. Operating over a wide frequency range (20 Hz-20 kHz), the headphone uses an innovative, robust design to ensure constant acoustical back volume, with THD of the design being measured at only 2 percent at 50 Hz. Also, an integrated bass pipe system in the acoustic base delivers real bass boost - a particularly important feature for sound effects used in gaming devices.
The headphone is available in volume now. The sound panels will be introduced to the market in the second half of 2005.