Wednesday, November 25, 2015
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Black Friday Deals on Microsoft device
AMD Ends Driver Support For Radeon HD 5000 and 6000 series
New AMD Radeon Software Crimson Edition Available For Download
ASUS RoG Announces Maximus VIII Hero Alpha
Apple To Brings Apple Pay To China
Xiaomi Launches New Redmi Note 3 Smartphone And Mi Pad 2 Tablet
Dell Says Security Hole Identified In Some Laptops
Sony PlayStation 4 Now Available For $299
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > Mobiles > SAMSUNG...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, February 23, 2005
SAMSUNG Electronics Begins Mass Producing World?s Largest-capacity Multi-chip Package for Mobile Applications

The new 2.5Gb MCP will enable multimedia-intensive mobile phones, especially 3G phones, to have memory levels that, for the first time, are equivalent to that of a personal computer's main memory: 320MBytes.

As mobile phones become slimmer and lighter, their increasing functionality continues to become more sophisticated and diverse. Today's handset designs must be able to support multimedia, including digital multimedia broadcasting (DMB). This requires higher capacity memory, particularly that afforded by multiple chip package designs.

Samsung's new 2.5Gb MCP consists of four dies ? a stack of two 1Gb NAND flash memory chips and two 256Mb Mobile DRAMs. The new MCP operates on only 1.8 volts and is capable of storing up to four hours of high-quality (QVGA) video data. Its capacity of 2.5Gb far exceeds the current 1.5Gb capacity level.

Samsung's MCPs can be configured in many different ways to accommodate a wide variety of specific applications. This multi-function device is helping mobile phone makers to utilize the limited space inside their products much more efficiently.

Samsung continues to lead the market in the development and introduction of high-density multi-chip packages, one of the fastest growing areas of its semiconductor business. Complimenting its recently announced development of the industry's first eight-chip MCP, the new 2.5Gb MCP also is expected to accelerate the introduction of smaller, more versatile 3G mobile phones.

The market research firm iSuppli predicts that the market for 3G mobile phones will grow an average of 78% a year through 2008, when 240 million units will be sold worldwide.

Samsung is the only company producing NAND flash memory, Moible DRAM, NOR flash memory and UtRAM at the same time ? all of the types of memory that can be used in the design of multi-chip packages today.

First Images from Taiwan of the new Ridisc Xtreme Ritek G05 disc        All News        One of the best uninstallers is now available in a new version!
Handsets with Electronic Money Function     Mobiles News      Asia Optical aims to be world's largest maker of phone camera lenses in 2006

Source Link Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Pay Adds Eight More Credit and Debit Card Issuers
UK High Court Rules Samsung and Huawei Infringe LTE Patent
Samsung Display Is Seeking OLED Growth Through Apple Deal
Samsung To Release Bio Processor Next Year
Samsung Officially Unveils The Exynos 8 Octa Application Processor
Samsung Prepares For Entry In Auto Technology
Samsung Electronics Takes The Lead in Smartphone Sales Worldwide
Samsung To Use Both Exynos 8890, Snapdragon 820 SoCs In Galaxy S7
Samsung Adds Two New Laptops to ATIV Line
Google Finds Security Holes In New Samsung Galaxy S6 Edge
Samsung Galaxy On5 and On7 Smartphones Showcased in India
Samsung Electronics Reports 3Q Profit

Most Popular News
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .