Saturday, November 29, 2014
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Sony's New E-Paper FES Watch Appears Online
Amazon Releases Deals of the Year on Cyber Monday
Germany To Get Secure Phones By BlackBerry
Xbox And Playstation Black Friday Deals
Toshiba Launches ARM-Based Application Processors with Sound, Image Data-Mining and Security Functions
Pioneer To Release The BDR-XU03JM Portable Blu-ray Drive For Macs
Syrian Electronic Army targets CNBC, Telegraph, Independent, PCWorld
GoPro Camera Drones In The Works: report
Active Discussions
Hi All!
cdrw trouble
CDR for car Sat Nav
DVD/DL for Optiarc 7191S at 8X
Copied dvd's say blank in computer only
Made video, won't play back easily
New Features In Firefox 33
updated tests for dvd and cd burners
 Home > News > Mobiles > SAMSUNG...
Last 7 Days News : SU MO TU WE TH FR SA All News

Wednesday, February 23, 2005
SAMSUNG Electronics Begins Mass Producing World?s Largest-capacity Multi-chip Package for Mobile Applications


The new 2.5Gb MCP will enable multimedia-intensive mobile phones, especially 3G phones, to have memory levels that, for the first time, are equivalent to that of a personal computer's main memory: 320MBytes.

As mobile phones become slimmer and lighter, their increasing functionality continues to become more sophisticated and diverse. Today's handset designs must be able to support multimedia, including digital multimedia broadcasting (DMB). This requires higher capacity memory, particularly that afforded by multiple chip package designs.

Samsung's new 2.5Gb MCP consists of four dies ? a stack of two 1Gb NAND flash memory chips and two 256Mb Mobile DRAMs. The new MCP operates on only 1.8 volts and is capable of storing up to four hours of high-quality (QVGA) video data. Its capacity of 2.5Gb far exceeds the current 1.5Gb capacity level.

Samsung's MCPs can be configured in many different ways to accommodate a wide variety of specific applications. This multi-function device is helping mobile phone makers to utilize the limited space inside their products much more efficiently.

Samsung continues to lead the market in the development and introduction of high-density multi-chip packages, one of the fastest growing areas of its semiconductor business. Complimenting its recently announced development of the industry's first eight-chip MCP, the new 2.5Gb MCP also is expected to accelerate the introduction of smaller, more versatile 3G mobile phones.

The market research firm iSuppli predicts that the market for 3G mobile phones will grow an average of 78% a year through 2008, when 240 million units will be sold worldwide.

Samsung is the only company producing NAND flash memory, Moible DRAM, NOR flash memory and UtRAM at the same time ? all of the types of memory that can be used in the design of multi-chip packages today.



Previous
Next
First Images from Taiwan of the new Ridisc Xtreme Ritek G05 disc        All News        One of the best uninstallers is now available in a new version!
Handsets with Electronic Money Function     Mobiles News      Asia Optical aims to be world's largest maker of phone camera lenses in 2006

Source Link Get RSS feed Easy Print E-Mail this Message

Related News
Far Cry 4 Game Available For Free With Purchase of 840 EVO SSD
Samsung's DeepSort Sorting Engine Prevails In Benchmarks
Samsung Introduces EYECAN+ Mouse for People with Disabilities
Samsung to Phase Out Mobile App Service
Samsung Files ITC Complaint Against Nvidia
Samsung Loses Bid Against Microsoft
Samsung To Offer More Affordable Phones In 2015
Samsung To Make Future Application Processors For Apple: report
Samsung Opens Pre-orders For Black Friday Deals
Samsung Challenges Apple iBeacon With Proximity
Samsung Introduces Gear VR Innovator Edition, 3D capturing Project, New Advanced S Pen, SIMBAND Fitness Wearable
Samsung To Use New UFS memory In Upcoming Flagship Smartphone

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2014 - All rights reserved -
Privacy policy - Contact Us .