Tuesday, November 21, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
GPU Shipments in Q3: AMD Increased 8 percent, Nvidia Increased 30 Percent
Samsung Says New SZ985 Z-NAND SSD Offers Ultra-Low Latency and High Throughput
AMD EPYC Processor Powers the New HPE Gen10 Server
Volvo to Supply Thousands of Self-driving Cars to Uber
Marvell Technology to Buy Cavium for $6 billion
Honor 7X is Official Coming with a FullView Display
Samsung Forecast to Top Intel as Larger Semiconductor Supplier in 2017
Samsung, LG Electronics Cut TV Prices for Black Friday
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Mobiles > SAMSUNG...
Last 7 Days News : SU MO TU WE TH FR SA All News

Tuesday, January 11, 2005
SAMSUNG Electronics Develops World's First Eight-die Multi Chip Package for Multimedia Cell Phones


Samsung Electronics Co., Ltd. announced that it has developed the world's first eight-die multi-chip package(MCP) technology, designed for use in high capacity mobile devices such as 3G handsets and other increasingly smaller mobile devices.

Typically, as the number of chips per memory package increases, so does the thickness of the package. Using its Wafer Supporting System technology to makes wafers thinner during design processing, Samsung has been able to minimize overall chip thickness as well as decrease the space between the stacked dies. As a result, the eight-die MCP solution offers an unmatched combined capacity of 3.2 gigabits in a package that is 1.4mm thick, equaling the thickness of a four-die MCP solution.

The new eight-chip MCP is an extremely compact, high-capacity solution that is likely to trigger development of new next-generation mobile applications. It will provide much greater functionality in cell phones and other smart mobile devices, from movie videos to games as well as faster Internet access.

The new eight-die MCP uses all the memory chips available today for mobile products in a single 11 x 14 x 1.4mm package. It includes two 1Gb NAND flash memories, two 256Mb NOR flash memories, two 256Mb mobile DRAMs, one 128Mb UtRAM and one 64Mb UtRAM.

The market research organization, iSuppli, has predicted that the 3G mobile phone market will expand an average of 87 percent a year. Samsung Electronics, a leader in next-generation multi-function package technology, is the world's largest supplier of DRAM, SRAM and NAND flash memory chips.



Previous
Next
Philips targets DDR2 memory modules with new high-speed registers        All News        LG develops new cell phone for 3-D games
VoIP to get boost from mobile-phone sales     Mobiles News      LG develops new cell phone for 3-D games

Source Link Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Says New SZ985 Z-NAND SSD Offers Ultra-Low Latency and High Throughput
Samsung Forecast to Top Intel as Larger Semiconductor Supplier in 2017
Samsung, SK Hynix and Micron Lead the Server DRAM Market
Samsung Invests More Than Intel and TSMC in Semiconductor Business
Samsung Lithium-air Battery Has Twice The Capacity of Li-ion Technology
Supreme Court Rejects Samsung Appeal in Apple Patent Case
ITC Launches Probe into Samsung's Chipmaking Patent
Samsung Unveils Business-oriented Galaxy Note8 Enterprise Edition
Samsung Reports Strong 3Q Results on Semiconductor Profits
Samsung Introduces the New Galaxy Tab A
Samsung to Support New Startups Spinning-Off from C-Lab Program
Apple, Samsung Heading to Court Again

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .