Sunday, February 01, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
South Korea's Antitrust Authority Aims At Google, Apple
Bill Gates Sees Future In Robots
Pirate Bay Back Online
ASUS Announces The B85M-Gamer Mainboard
AT&T, Verizon Among Winners Of US Airwaves Auction
Apple Closes the Gap on Samsung Fourth Quarter's Worldwide Smartphone Shipments
Verizon To Let Users Opt Out Supercookies
Microsoft Outlines Windows 10 Options For The Enterprise
Active Discussions
Why Double Logins ?
retrieving burned cd information
Writing Audio files on DVDs ?
Need major help with Gigabeat
New match-3 puzzle game launch now!
Rimage 2000i
Sound card for my Laptop
hello
 Home > News > Mobiles > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, January 10, 2005
Samsung Electronics Develops World's First Eight-Die Multi-Chip Package Technology for Multimedia Cell Phones


Samsung Electronics announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high-capacity mobile devices such as 3G handsets and other increasingly smaller mobile devices.

Typically, as the number of chips per memory package increases, so does the thickness of the package. Using its Wafer Supporting System technology to make wafers thinner during design processing, Samsung has been able to minimize overall die thickness as well as decrease the space between the stacked dies. As a result, the eight-die MCP solution offers an unmatched combined capacity of 3.2 gigabits in a package that is 1.4mm thick, equaling the thickness of a four-die MCP solution.

The new eight-chip MCP is an extremely compact, high-capacity solution that is likely to trigger development of new next-generation mobile applications. It will provide much greater functionality in cell phones and other smart mobile devices, from movie videos to games as well as faster Internet access.

The new eight-die MCP uses all the memory devices available today for mobile products in a single 11 x 14 x 1.4mm package. It includes two 1Gb NAND flash memories, two 256Mb NOR flash memories, two 256Mb mobile DRAMs, one 128Mb UtRAM and one 64Mb UtRAM.

The market research organization, iSuppli, has predicted that the 3G mobile phone market will expand an average of 87 percent a year. Samsung Electronics, a leader in next-generation multi-function package technology, is the world's largest supplier of DRAM, SRAM and NAND flash memory chips.


Previous
Next
Porn could decide DVD format battle        All News        AMD Kicks off New Year With Mobile Performance Personified
Momentum gaining for cell phones as credit cards     Mobiles News      China tops 329 million mobile phone subscribers

Get RSS feed Easy Print E-Mail this Message

Related News
Apple Closes the Gap on Samsung Fourth Quarter's Worldwide Smartphone Shipments
Samsung Reports Weak Q4 Results
Apple Takes Top Spot in China's Smartphone Market
Samsung Advances Smart eMBMS Solution with Improved Video
Samsung Engineers Develop Wearable Sensor for Stroke Detection
Samsung and Apple Together Consumed 17 Percent of Total Semiconductor Demand in 2014
Samsung Drops Qualcomm 810 Processors in next Galaxy S Due To Overheating: report
Samsung Led The Smartphone Market in 2014, TrendForce Reports
Galaxy S6 Expected to Have Displays On Both Edges
Samsung Starts Mass Production Of 8-Gigabit Graphics DRAM
Samsung, Blackberry Deny Deal Report
Samsung Made A Bid For BlackBerry: report

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .