Friday, September 04, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Report Reveals the Web's Shadiest Neighborhoods
Google Play Is Coming Back To China: report
Hackers Stole Data From Bugzilla
BlackBerry To Buy Rival Good Technology
GIGABYTE Z170X-UD5 Motherboard Is Intel Thunderbolt 3 Certified
LG Bets On OLED's Success, Showcases Innovative Prototypes At IFA2015
Acer's Predator 6 Smartphone Packs A 10-core Processor
New Intuos Tablets Bring Your Creative Dreams Closer
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > Mobiles > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, January 10, 2005
Samsung Electronics Develops World's First Eight-Die Multi-Chip Package Technology for Multimedia Cell Phones


Samsung Electronics announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high-capacity mobile devices such as 3G handsets and other increasingly smaller mobile devices.

Typically, as the number of chips per memory package increases, so does the thickness of the package. Using its Wafer Supporting System technology to make wafers thinner during design processing, Samsung has been able to minimize overall die thickness as well as decrease the space between the stacked dies. As a result, the eight-die MCP solution offers an unmatched combined capacity of 3.2 gigabits in a package that is 1.4mm thick, equaling the thickness of a four-die MCP solution.

The new eight-chip MCP is an extremely compact, high-capacity solution that is likely to trigger development of new next-generation mobile applications. It will provide much greater functionality in cell phones and other smart mobile devices, from movie videos to games as well as faster Internet access.

The new eight-die MCP uses all the memory devices available today for mobile products in a single 11 x 14 x 1.4mm package. It includes two 1Gb NAND flash memories, two 256Mb NOR flash memories, two 256Mb mobile DRAMs, one 128Mb UtRAM and one 64Mb UtRAM.

The market research organization, iSuppli, has predicted that the 3G mobile phone market will expand an average of 87 percent a year. Samsung Electronics, a leader in next-generation multi-function package technology, is the world's largest supplier of DRAM, SRAM and NAND flash memory chips.


Previous
Next
Porn could decide DVD format battle        All News        AMD Kicks off New Year With Mobile Performance Personified
Momentum gaining for cell phones as credit cards     Mobiles News      China tops 329 million mobile phone subscribers

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Seeks Piece of Nascent Smartwatch Market With New Gear S2 Smartwatch
Samsung Focuses On The Internet of Things at IFA 2015
IFA: Samsung Launches The "HumanFit" Wearable Platform
Samsung IoT Device Will Take Care Of Your Sleep
Samsung's Circular Gear S2 Smartwatches Unveiled
Samsung Used TSMC's Technology To Prevail In Chip Manufacturing Race
Samsung To Accelerate Chip Production
Samsung Announces New Wireless Audio 360 Speakers
Samsung Says Users Should Follow The Manual With Galaxy Note 5 Stylus
Samsung To Give iPhone Users The new Galaxy Smartphones
New Galaxy Note 5 Phablet Has The Best Display: report
Samsung Offers USB Flash Drive Family

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .