Tuesday, May 30, 2017
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
New Ballistix Tactical Tracer DDR4 Gaming Memory Modules Get RGB Lighting
SK Hynix and Micron Try To Catch up With Samsung in 10nm DRAM Production
CORSAIR Unveils Concept Curve, Concept Slate, SYNC IT and Host of New Liquid Cooling Options at COMPUTEX
Computex 2017: Dell Debuts Inspiron AIOs and VR Gaming Desktop
Samsung Announces New Virtual Reality Partnerships with UFC, X-Games and Live Nation
Computex: Qualcomm Unveils Mesh Networking Platform and Reference Design
Computex: GeForce Partners Unveil Over 40 New Products based on NVIDIA's Max-Q Design
Computex: Western Digital to Deliver First Client Solid State Drives with 64-Layer 3D NAND Technology
Active Discussions
Which of these DVD media are the best, most durable?
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
Help make DVDInfoPro better with dvdinfomantis!!!
menu making
Optiarc AD-7260S review
cdrw trouble
 Home > News > Mobiles > Samsung...
Last 7 Days News : SU MO TU WE TH FR SA All News

Monday, January 10, 2005
Samsung Electronics Develops World's First Eight-Die Multi-Chip Package Technology for Multimedia Cell Phones


Samsung Electronics announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high-capacity mobile devices such as 3G handsets and other increasingly smaller mobile devices.

Typically, as the number of chips per memory package increases, so does the thickness of the package. Using its Wafer Supporting System technology to make wafers thinner during design processing, Samsung has been able to minimize overall die thickness as well as decrease the space between the stacked dies. As a result, the eight-die MCP solution offers an unmatched combined capacity of 3.2 gigabits in a package that is 1.4mm thick, equaling the thickness of a four-die MCP solution.

The new eight-chip MCP is an extremely compact, high-capacity solution that is likely to trigger development of new next-generation mobile applications. It will provide much greater functionality in cell phones and other smart mobile devices, from movie videos to games as well as faster Internet access.

The new eight-die MCP uses all the memory devices available today for mobile products in a single 11 x 14 x 1.4mm package. It includes two 1Gb NAND flash memories, two 256Mb NOR flash memories, two 256Mb mobile DRAMs, one 128Mb UtRAM and one 64Mb UtRAM.

The market research organization, iSuppli, has predicted that the 3G mobile phone market will expand an average of 87 percent a year. Samsung Electronics, a leader in next-generation multi-function package technology, is the world's largest supplier of DRAM, SRAM and NAND flash memory chips.


Previous
Next
Porn could decide DVD format battle        All News        AMD Kicks off New Year With Mobile Performance Personified
Momentum gaining for cell phones as credit cards     Mobiles News      China tops 329 million mobile phone subscribers

Get RSS feed Easy Print E-Mail this Message

Related News
Samsung Wants to Lead the Foundry Race With Process Roadmap Down to 4nm
Hackers Expose Galaxy S8's Iris Scanner Security, Samsung Investigates Issue
Samsung Pay Launches in the U.K.
Samsung Galaxy Note 8 Said To Have Dual-cameras
Accessory Line-up for the Samsung Galaxy S8 and Galaxy S8+
Samsung Creates New Chip Foundry Division
Samsung Names New Mobile Marketing Chief
Samsung Display Breaks Ground For New Flexible OLED Fab
Samsung On Track to Beat Intel in Semiconductor Sales
Samsung to Invest $2.64 Billion To Expand Its DRAM Production
Samsung And Apple Maintain Top Spots in Smartphone Market
Apple Pay, Samsung Pay and Android Pay Set To Expand This Year

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2017 - All rights reserved -
Privacy policy - Contact Us .