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Tuesday, September 07, 2004
Rambus to Showcase World's First Demonstration of XDR Memory Module Technology


Rambus Inc. (Nasdaq:RMBS), the leading developer of chip interface products and services, today announced the first-of-its-kind live demonstration of Dynamic Point-to-Point (DPP) technology applied to an XDR(TM) memory system.

Rambus's DPP technology is a unique innovation applicable to upgrades for memory modules using point-to-point signaling, allowing users to maximize capacity in their memory systems without compromising performance. This demonstration, being held in Booth 104 at the Intel Developer Forum in San Francisco, displays a high-speed memory controller conducting bi-directional transactions to an XDIMM(TM) module-based system.

"Once memory speeds surpass 1 gigahertz data rates, routing data busses to multiple upgradeable modules becomes a challenge," said Rich Warmke, director of marketing for the Memory Interface Division at Rambus. "To meet the future needs of the PC and home server memory markets, Rambus's DPP technology will be critical for OEMs who want to ship future high-performance memory-enabled PCs or home servers with a single module at full system bandwidth, with the option for a second module upgrade."

A single XDR memory-enabled XDIMM module provides 12.8-25.6 gigabytes per second of peak memory bandwidth using just 32 data signal pairs, and supports between 2 and 18 DRAM devices for a wide range of capacities.

In addition to 3.2GHz to 6.4GHz XDR memory interfaces, Rambus offers DDR and GDDR memory interface solutions for less demanding memory applications. With DDR and GDDR interfaces, Rambus is providing customers with a one-stop shop for all their memory interface needs.

The Dynamic Point-to-Point demonstration using XDIMM modules is being showcased at the Intel Developer Forum, September 7-9, 2004 at Moscone South Convention Center in San Francisco. For more information on DPP as well as other Rambus innovations, visit www.rambus.com.


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