Monday, August 03, 2015
Search
  
Submit your own News for
inclusion in our Site.
Click here...
Breaking News
Xiaomi Has Reclaimed Top Spot in China, Huawei Pushes Ahead of Apple
Older Noctua Heatsinks To Support Upcoming Skylake Ptrocessors
Sony's Midrange Xperia C5 Ultra and M5 Smartphones Come With Strong Cameras
Photos of Upcoming Samsung Phablet Appear Online
Lattice Releases First superMHL Solutions for USB Type-C
AUDI AG, BMW Group and Daimler AG To Buy Nokia's HERE Digital Mapping Business
AT&T To Offer Wireless Service And DirecTV's Pay-TV Offerings
Microsoft Sees Growth Beyond The Desktop With Windows 10
Active Discussions
How to back up a PS2 DL game
Copy a protected DVD?
roxio issues with xp pro
How to burn a backup copy of The Frozen Throne
Help make DVDInfoPro better with dvdinfomantis!!!
Copied dvd's say blank in computer only
menu making
Optiarc AD-7260S review
 Home > News > General Computing > SAMSUNG...
Last 7 Days News : SU MO TU WE TH FR SA All News

Thursday, September 02, 2004
SAMSUNG Electronics Produces World's Highest-capacity Smart Card IC


SAMSUNG launches a 256KB EEPROM built-in smart card. The high-density device incorporates a 16-bit CPU(CalmRISC16) and hardware 3-DES.

The product is targeting high-end smart card application areas including mobile banking. The smart card market is growing at CAGR 17% from 2004 to 2007.

SEOUL, Korea - August 31, 2004 - Samsung Electronics Co., Ltd., a leader in advanced s emiconductor technology, completes a full line up of high performance, high-capacity smart card technology with the introduction of the world's first 256-kilobyte (KB) EEPROM (Electrically Erasable and Programmable ROM) embedded smart card. The new smart card IC (part number: S3CC9EF) has a broad range of applications that include the User Identity Module (UIM) and Universal Subscriber Identity Module (USIM) for GSM/GPRS and IMT 2000 handsets, Java cards, multimedia products, and electronic passports, demand for which has surged to ensure security measures in individual identification systems.

The S3CC9EF features a 256KB EEPROM, 384KB ROM and 8KB static RAM to satisfy completely the specifications required by makers of high-performance smart cards and Subscriber Identity Module cards. The SIM cards need a high-capacity EEPROM to not only store individual subscriber data but also retain various data needed for a mobile phone to run games, access Internet services, provide a telephone directory and take advantage of text data services.

On the hardware side, Samsung's S3CC9EF comes with a 16-bit CalmRISC CPU developed in-house and triple DES, the standard symmetrical key encryption. The smart card IC is fast and highly reliable in protecting the user ID. An attack prevention design technology has been applied to prevent hackers from accessing personal data.

?Samsung Electronics has developed and supplied smart card ICs equipped with the highest-capacity, 256KB EEPROMs following 128KB EEPROM product last year. As such, we have been leading the technology for high-performance, high-capacity smart cards.

Our devices support diverse application programs that require large amounts of data such as games and internet access,? said Chilhee Chung, Vice President of Samsung Electronics' System LSI business. ?In the process, we have contributed to the increase of performance level for the smart cards and multimedia services and look forward to positioning the Samsung's advanced smart card technology in future 3G SIM card markets with the availability of the new high density memory built-in smart card.?

The S3CC9EF has been shipped to major European card maker for high density memory embedded SIM card and is currently available for sales worldwide.

Samsung now has a full lineup of EEPROM embedded smart card ICs from 8 KB to 256KB. As a result, the company can further support customers with its wide range of advanced card solutions fulfilling customer demands and enforcing its market competitiveness.

Importantly, Samsung Electronics has received international certifications such as EAL4+ and VISA Hardware Architecture Level 3 for six of its smart card ICs, including the recently completed device with 64KB EEPROM. Gartner Dataquest, the market analysis firm, predicts the global smart card market will reach 1.16 billion units in 2004 and average 17% annual growth to some 1.87 billion units by 2007.



Previous
Next
Hitachi drive to connect with consumer devices        All News        Microsoft Wins a High-Definition DVD Battle
Hitachi drive to connect with consumer devices     General Computing News      Logitech Unveils MX 1000 Laser Cordless Mouse 20 Times More Sensitive to Detail

Get RSS feed Easy Print E-Mail this Message

Related News
Photos of Upcoming Samsung Phablet Appear Online
Galaxy S6 Sales Not Enough To Keep Samsung's Profit High
Samsung Starts Mass Production Of First Mobile Image Sensor with 1.0µm Pixels
Samsung To Showcase New Galaxy Phablet on August 13 Event
Smartphone Market Posts Year-Over-Year Growth in Q2 2015
Samsung Unveils New Data Center Solid State Drives
New Galaxy J2 Coming In S. Korea
Samsung Galaxy Tab S2 Tablet Coming Next Month
Samsung Launches The Ultra-slim Galaxy A8 in China
Samsung To Develop 11K Super-Resolution Display
Next Generation Samsung Galaxy Note To Come In August
Samsung Galaxy Grand Prime Arrives At Sprint

Most Popular News
 
Home | News | All News | Reviews | Articles | Guides | Download | Expert Area | Forum | Site Info
Site best viewed at 1024x768+ - CDRINFO.COM 1998-2015 - All rights reserved -
Privacy policy - Contact Us .